Title:
DOUBLE-SIDE POLISHING DEVICE FOR WORKPIECE, AND DOUBLE-SIDE POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/254856
Kind Code:
A1
Abstract:
The present invention provides a double-side polishing device for a workpiece that, during double-side polishing, can end the double-side polishing at a timing at which the shape of the entire workpiece and the outer circumferential portion of the workpiece reaches a target shape. A computing unit 13 finds, from data regarding thickness of a workpiece that is measured by a workpiece thickness measuring instrument, a shape component of the workpiece, a position of the shape component of the workpiece in a radial direction on the workpiece, a shape distribution of the workpiece, and a shape index of the entire workpiece, determines a timing, at which the shape index of the entire workpiece of each workpiece obtained reaches a set value for the shape index of the entire workpiece, decided on the basis of a deviation between a target value for the shape index of the entire workpiece in a current batch and a history value of the shape index of the outer circumferential portion of a workpiece in the previous batch, and deviation of the history value of the shape index of the outer circumferential portion of the workpiece in the previous batch from a target range for the shape index of the entire workpiece in the current batch, as the timing to end the double-side polishing, and ends the double-side polishing at this timing.
Inventors:
MIYAZAKI YUJI (JP)
TAKANASHI KEIICHI (JP)
AZUMA SHINGO (JP)
TAKANASHI KEIICHI (JP)
AZUMA SHINGO (JP)
Application Number:
PCT/JP2022/010113
Publication Date:
December 08, 2022
Filing Date:
March 08, 2022
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B37/013; B24B37/08; B24B49/04; B24B49/12; H01L21/304
Foreign References:
| JP2020015122A | 2020-01-30 | |||
| JP2019118975A | 2019-07-22 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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