Title:
DOUBLE SIDE POLISHING MACHINE
Document Type and Number:
WIPO Patent Application WO/2007/110896
Kind Code:
A1
Abstract:
A double side polishing machine which can apply a load uniformly to a work by suppressing deflection of an upper lapping plate while suppressing variation thereof. The double side polishing machine comprises a turnable lower lapping plate, a turnable upper lapping plate which can be elevated/lowered freely with respect to the lower lapping plate by means of an elevating mechanism, a carrier clamped by the upper and lower lapping plates and to which a plurality of works are attached, and a mechanism for making the carrier spin and revolve between the upper and lower lapping plates, wherein a plate for suspending the upper lapping plate is connected to an upper portion of a coupling mechanism provided at the end of the vertically movable supporting rod of the elevating mechanism to oscillate freely, and the oscillation fulcrum of the coupling mechanism is located on a plane substantially flush with the polishing surface of the upper lapping plate.
Inventors:
NAGASHIMA TOSHIO (JP)
Application Number:
PCT/JP2006/305932
Publication Date:
October 04, 2007
Filing Date:
March 24, 2006
Export Citation:
Assignee:
TSC CORP (JP)
NAGASHIMA TOSHIO (JP)
NAGASHIMA TOSHIO (JP)
International Classes:
B24B37/08
Foreign References:
| JP2003048156A | 2003-02-18 | |||
| JP2002361551A | 2002-12-18 | |||
| JP2000271843A | 2000-10-03 | |||
| JPH11179651A | 1999-07-06 | |||
| JP2005199387A | 2005-07-28 | |||
| JP2000225563A | 2000-08-15 | |||
| US6196907B1 | 2001-03-06 |
Attorney, Agent or Firm:
OHNUKI, Kazuyasu et al. (8-8 Shibuya 1-chome,Shibuya-ku, Tokyo02, JP)
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