Title:
DOUBLE-SIDED ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/190227
Kind Code:
A1
Abstract:
Provided is a double-sided adhesive sheet which has excellent film processability and excellent adhesiveness. This double-sided adhesive sheet 3 comprises a substrate layer 1 and adhesive layers 2 including a heat-curable resin and superposed respectively on both surfaces of the substrate layer 1, wherein the substrate layer 1 has a modulus of 50-200 GPa. The double-sided adhesive sheet 3 has a modulus of 2-195 GPa. The heat-curable resin preferably includes a modified epoxy resin. The modulus of the substrate layer 1 is preferably 50-100 GPa. The substrate layer 1 has a thickness of preferably 2-40 μm.
Inventors:
TAKAMI KOUJI (JP)
WATANABE MASAHIRO (JP)
TAKESHITA SIGEKI (JP)
WATANABE MASAHIRO (JP)
TAKESHITA SIGEKI (JP)
Application Number:
PCT/JP2023/011970
Publication Date:
October 05, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C09J7/20; B32B7/022; B32B27/00; B32B27/38; C09J7/35
Domestic Patent References:
| WO2017104479A1 | 2017-06-22 |
Foreign References:
| JP2018172529A | 2018-11-08 | |||
| JP2008277384A | 2008-11-13 | |||
| JP2013053294A | 2013-03-21 | |||
| JP2021141108A | 2021-09-16 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
Download PDF: