DOUBLE-SIDED COOLING TYPE POWER MODULE AND MANUFACTURING METHOD THEREFOR

Title:

DOUBLE-SIDED COOLING TYPE POWER MODULE AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2019/182216

Kind Code:

A1

Abstract:

A power module according to an embodiment of the present invention comprises: a first substrate having metal plates formed on one surface thereof; a second substrate spaced apart from the first substrate and having metal plates formed on one surface thereof facing the metal plates of the first substrate; a plurality of power elements disposed between the first substrate and the second substrate; a first electrode formed on the first surface of each of the plurality of power elements; and a second electrode formed on the second surface of each of the plurality of power elements, wherein the plurality of power elements comprise a first power element in which the first electrode is bonded to the metal plates of the second substrate; and a second power element in which the first electrode is bonded to the metal plates of the first substrate.

Inventors:

OH HEONCHEOL (KR)
MIN JAESANG (KR)
PARK YONGHEE (KR)
LEE JINWOO (KR)
CHO HEEJIN (KR)

Application Number:

PCT/KR2018/012402

Publication Date:

September 26, 2019

Filing Date:

October 19, 2018

Export Citation:

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Assignee:

LG ELECTRONICS INC (KR)

International Classes:

H02M7/00; H02M7/44; H05K7/20

Foreign References:

JP2015225918A	2015-12-14
JP2016039206A	2016-03-22
JP2013016623A	2013-01-24
JP2012174711A	2012-09-10
KR20170092750A	2017-08-14

Other References: