Title:
DOUBLE-SIDED POLISHING METHOD FOR WORKPIECE AND DOUBLE-SIDED POLISHING DEVICE FOR WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2020/194971
Kind Code:
A1
Abstract:
This double-sided polishing method for a workpiece comprises: a pre-polishing index calculation step for, after performing double-sided polishing of a previous batch, calculating an index Xp for the workpiece on which the double-sided polishing was performed; a target polishing time calculation step for calculating a target polishing time for the current batch using a prescribed prediction formula; and a double-sided polishing step for performing double-sided polishing on a workpiece according to the target polishing time. This double-sided polishing device for a workpiece comprises: a measurement unit that, after double-sided polishing of the previous batch, measures the thickness of the workpiece on which the double-sided polishing was performed; a first calculation unit that calculates the index Xp; a second calculation unit that uses a prescribed prediction formula to calculate a target polishing time Tt for the current batch; and a control unit that performs control such that double-sided polishing is performed on the workpiece according to the target polishing time Tt.
Inventors:
MIYAZAKI YUJI (JP)
Application Number:
PCT/JP2019/051215
Publication Date:
October 01, 2020
Filing Date:
December 26, 2019
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B37/005; B24B37/08; B24B49/03; H01L21/304
Foreign References:
| JPH10106984A | 1998-04-24 | |||
| JP2013094954A | 2013-05-20 | |||
| JP2015047656A | 2015-03-16 | |||
| JP2017207455A | 2017-11-24 | |||
| JP2002154053A | 2002-05-28 | |||
| JP2002124497A | 2002-04-26 | |||
| JP2012033585A | 2012-02-16 | |||
| JP2004319574A | 2004-11-11 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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