DOUBLE-SIDED POLISHING METHOD

WIPO Patent Application WO/2021/230022

A1

The present invention provides a double-sided polishing method in which a plurality of carriers are installed between an upper surface plate and a lower surface plate of a rotating surface plate having a surface plate center, one or more wafers are held by each of the plurality of carriers, and both sides of the wafers are polished while a slurry is supplied by a pumping process, the double-sided polishing method being characterized in that: the placement of the wafers held by the plurality of carriers is carried out such that the difference between the average thickness A μm of wafers positioned on a reference carrier and the average thickness B μm of wafers positioned on a symmetrically positioned carrier is 1.0 μm or less, where the reference carrier is selected from among the plurality of carriers, and the symmetrically positioned carrier is the one or two carriers for which the angle α formed relative to the reference carrier and the surface plate center, with the surface plate center as the angle center, is maximized; and the double-sided polishing of the wafers is carried out. This makes it possible to provide a pumped slurry double-sided polishing method with which it is possible to provide a wafer group in which variations in flatness after double-sided polishing have been reduced.

TANAKA YUKI (JP)

PCT/JP2021/016109

November 18, 2021

April 21, 2021

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SHINETSU HANDOTAI KK (JP)

B24B37/08; B24B37/00; B24B37/28; H01L21/304

WO2019159603A1

2019-08-22

JP2015069685A	2015-04-13
JP2001121412A	2001-05-08

YOSHIMIYA Mikio et al. (JP)

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