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Title:
DOUBLE-SIDED WORKPIECE POLISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2015/097947
Kind Code:
A1
Abstract:
This double-sided workpiece polishing apparatus is provided with a rotating surface plate having an upper surface plate and a lower surface plate, a sun gear, an internal gear, and a carrier plate provided with at least one holder opening for holding the workpiece, and respective polishing pads are affixed on the lower surface of the upper surface plate and the upper surface of the lower surface plate. The apparatus is characterized in that: the upper surface plate or the lower surface plate has at least one pore that pierces the upper surface plate or the lower surface plate from the upper surface to the lower surface; the polishing pads are provided with a hole at the position(s) corresponding to the pore(s); the apparatus is also provided with a workpiece thickness meter capable of measuring the thickness of the workpiece through the one or more pores and holes in real time during double-sided polishing of the workpiece; a recess is provided at the bottom of the side wall of the upper surface plate demarcated by the pore or at the top of the side wall of the lower surface plate demarcated by the pore; a window material with a diameter larger than the diameter of the pore and the diameter of the hole is disposed in the recess; and said window material is fixed via an adhesive layer on the upper surface demarcated by the recess provided in the upper surface plate or on the lower surface demarcated by the recess provided in the lower surface plate.

Inventors:
MIURA TOMONORI (JP)
MIKURIYA SHUNSUKE (JP)
Application Number:
PCT/JP2014/004780
Publication Date:
July 02, 2015
Filing Date:
September 17, 2014
Export Citation:
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Assignee:
SUMCO CORP (JP)
International Classes:
B24B49/04; B24B37/013; B24B37/08; H01L21/304
Foreign References:
JP2002100594A2002-04-05
JP2003133270A2003-05-09
JP2005012182A2005-01-13
JP2007506280A2007-03-15
JP2006110686A2006-04-27
JP2009060044A2009-03-19
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
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