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Patent Searching and Data


Title:
DOWN PRODUCT HAVING BONDING PATTERN LINES FORMED BY HIGH-FREQUENCY BONDING TECHNIQUE AND METHOD FOR PRODUCING DOWN PRODUCT
Document Type and Number:
WIPO Patent Application WO/2017/003180
Kind Code:
A1
Abstract:
Down product having bonding pattern lines for compartmentalized separation according to the present invention can be produced without having to form a sewn hole or incurring damage to the fabric by printing and drying a thermally-reactive bonding solution into a set printing pattern on an inner fabric and/or the inner surface of an outer fabric or on a reinforcement member, and after combining the inner fabric, reinforcing member and outer fabric, bonding same in a compression pattern identical to the aforementioned printing pattern with the bonding solution by means of high-frequency heating under pressure. According to the present invention, by utilizing a high-frequency bonding technique using a thermally-reactive bonding solution and/or a bond-before-cut-after method in which compartmentalized separation lines are formed first to produce double-layered fabric and then the double-layered fabric is cut, down products having bonding pattern lines which integrate inner bonding lines and surface pattern lines can be produced, the inner bonding lines having excellent adhesiveness and durability, and surface pattern lines being distinctive and having excellent finishes and thus being esthetically pleasing. Additionally, the present invention allows mass production of down products by means of mechanization and automation.

Inventors:
PARK, Young Chul (1301, 39 Bongeunsa-ro 113-gil,,Gangnam-gu, Seoul, 06082, KR)
Application Number:
KR2016/006962
Publication Date:
January 05, 2017
Filing Date:
June 29, 2016
Export Citation:
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Assignee:
HOJEON LIMITED (11, 12Fl 19, Mapo-daero,,Mapo-gu, Seoul, 04165, KR)
International Classes:
A41D3/00; A41D27/24; A41H43/04
Foreign References:
KR101484103B12015-01-16
KR101513709B12015-04-22
JPH1156597A1999-03-02
KR20100001821U2010-02-19
KR100964968B12010-06-21
Attorney, Agent or Firm:
KOREANA PATENT FIRM (94, Gangnam-daero 94-gil,Gangnam-gu, Seoul, 06132, KR)
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