Title:
DRESSING APPARATUS AND WAFER POLISHING APPARATUS COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2017/073845
Kind Code:
A1
Abstract:
An embodiment according to the present invention relates to a dressing apparatus for cleaning a polishing pad attached to a lower surface plate, the dressing apparatus comprising: a brushing part comprising a brush; a cleaning solution spray unit, comprising a spray nozzle, for spraying the polishing pad with cleaning solution; and a suction unit, comprising a suction inlet, for suctioning particles generated when the cleaning solution is sprayed by the cleaning solution spray unit, wherein the brushing unit, cleaning solution spray unit and suction unit are attached to each other and swing above the polishing pad in unison.
Inventors:
LEE SEUNG WON (KR)
Application Number:
PCT/KR2016/000933
Publication Date:
May 04, 2017
Filing Date:
January 28, 2016
Export Citation:
Assignee:
LG SILTRON INC (KR)
International Classes:
H01L21/02; H01L21/304; H01L21/306; H01L21/67
Foreign References:
| JP2000042899A | 2000-02-15 | |||
| US20080102737A1 | 2008-05-01 | |||
| US20070087672A1 | 2007-04-19 | |||
| KR20040070588A | 2004-08-11 | |||
| KR20140019727A | 2014-02-17 |
Attorney, Agent or Firm:
PARK, Young Bok et al. (KR)
Download PDF: