Title:
DRIP-PROOF STRUCTURE OF ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/021155
Kind Code:
A1
Abstract:
This drip-proof structure of an electronic component comprises packings 250 (250a - 250d) disposed between a surrounding area of an opening H1 of first and second cases 20, 70 and a surrounding area of an exposure opening 305 of a cover 300. The packings 250 prevent liquid from entering from the exposure opening 305 of the cover 300 and passing between the first and second cases 20, 70 and the cover 300.
Inventors:
AOKI HIROSHI (JP)
TSUKAHARA YOSHIHARU (JP)
KUWABARA SATOSHI (JP)
HAYASHI NAOKI (JP)
TSUKAHARA YOSHIHARU (JP)
KUWABARA SATOSHI (JP)
HAYASHI NAOKI (JP)
Application Number:
PCT/JP2017/026361
Publication Date:
February 01, 2018
Filing Date:
July 20, 2017
Export Citation:
Assignee:
TOKAI RIKA CO LTD (JP)
International Classes:
H01H9/04; H01H19/06
Domestic Patent References:
| WO2015087366A1 | 2015-06-18 |
Foreign References:
| JP2011134573A | 2011-07-07 | |||
| JP2016091806A | 2016-05-23 |
Other References:
See also references of EP 3493232A4
Attorney, Agent or Firm:
HIRATA & PARTNERS (JP)
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