OF BUFFER TRANSISTORS

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims priority to and the benefit of Non-Provisional Application No.

15/012,696 filed in the U.S. Patent and Trademark Office on February 1, 2016, the entire content of which is incorporated herein by reference.

BACKGROUND

Field

[0002] Aspects of the present disclosure relate generally to input/output (I/O) drivers, and more particularly, to an I/O driver that implements dynamic gate biasing of buffer transistors for implementing the I/O driver using low-voltage transistors.

Background

[0003] An input/output (I/O) driver receives an input voltage that varies between a high logic voltage and a low logic voltage associated with a particular core voltage domain. In response to the input voltage, the I/O driver generates an output voltage that varies between a high logic voltage and a low logic voltage associated with an I/O voltage domain.

[0004] Generally, a difference between the high and low logic voltage of the I/O voltage domain is greater than a difference between the high and low logic voltage of the core voltage domain. This may be because the core circuitry of an integrated circuit (IC) operates with smaller voltages for higher processing speed and lower power consumption purposes.

[0005] When a voltage signal processed by the core circuitry is ready to be transmitted to another IC, the core circuitry provides the voltage signal as an input voltage to an I/O driver. As discussed above, the I/O driver generates an output voltage based on the input voltage, wherein the output voltage is in a higher voltage domain suitable for transmission of the signal to another IC or external device.

[0006] Generally, I/O drivers are implemented with field effect transistors (FETs) that are much larger than FETs implemented in core circuitry. This is because the FETs of I/O drivers need to be able to withstand the larger voltages associated with the I/O voltage domain. As a result, different masks and processes are needed to manufacture IC with relatively small FETs for the core circuitry and relatively large FETs for the I/O drivers. This produces higher costs and delays associated with the manufacture of such ICs.

SUMMARY

[0007] The following presents a simplified summary of one or more embodiments in order to provide a basic understanding of such embodiments. This summary is not an extensive overview of all contemplated embodiments, and is intended to neither identify key or critical elements of all embodiments nor delineate the scope of any or all embodiments. Its sole purpose is to present some concepts of one or more embodiments in a simplified form as a prelude to the more detailed description that is presented later.

[0008] An aspect of the disclosure relates to an apparatus including a pull-up circuit including a first transistor and a second transistor coupled in series between a first voltage rail and an output, and a pull-down circuit including a third transistor and a fourth transistor coupled in series between the output and a second voltage rail.

[0009] The apparatus further includes a first voltage generator configured to generate a first bias voltage for a control input of the second transistor, the first bias voltage configured to transition from a first relatively high voltage to a first relatively low voltage approximately when a voltage at the output begins transitioning from a first low logic voltage towards a first high logic voltage due to the pull-up circuit coupling the first voltage rail to the output and the pull-down circuit decoupling the output from the second voltage rail, and the first bias voltage also configured to transition from the first relatively low voltage to the first relatively high voltage while the output voltage continues to transition from the first low logic voltage towards the first high logic voltage.

[0010] Additionally, the apparatus includes a second voltage generator configured to generate a second bias voltage for a control input of the third transistor, the second bias voltage configured to transition from a second relatively low voltage to a second relatively high voltage approximately when the output voltage begins transitioning from the first high logic voltage towards the first low logic voltage due to the pull-down circuit coupling the output to the second voltage rail and the pull-up circuit decoupling the first voltage rail from the output, and the second bias voltage also configured to transition from the second relatively high voltage to the second relatively low voltage while the output voltage continues to transition from the first high logic voltage towards the first low logic voltage. [0011] Another aspect of the disclosure relates to a method including coupling a first voltage rail to an output by turning on a first transistor and a second transistor coupled in series between the first voltage rail and the output in response to an input voltage transitioning from a first low logic voltage to a first high logic voltage; and decoupling a second voltage rail from the output by turning off a third transistor and a fourth transistor coupled in series between the output and the second voltage rail in response to the input voltage transitioning from the first low logic voltage to the first high logic voltage, wherein a voltage at the output transitions from a second low logic voltage towards a second high logic voltage in response to the coupling of the first voltage rail to the output and the decoupling of the second voltage rail from the output.

[0012] The method further includes coupling the second voltage rail to the output by turning on the third transistor and the fourth transistor in response to the input signal transitioning from the first high logic voltage to the first low logic voltage; and decoupling the first voltage rail from the output by turning off the first transistor and the second transistor in response to the input signal transitioning from the first high logic voltage to the low logic voltage, wherein the output voltage transitions from the second high logic voltage towards the second low logic voltage in response to the coupling of the second voltage rail to the output and the decoupling of the first voltage rail from the output.

[0013] Additionally, the method includes transitioning a first bias voltage applied to a control input of the second transistor from a first relatively high voltage to a first relatively low voltage approximately when the output voltage begins transitioning from the second low logic voltage towards the second high logic voltage; transitioning a first bias voltage applied to a control input of the second transistor from a first relatively high voltage to a first relatively low voltage approximately when the output voltage begins transitioning from the second low logic voltage towards the second high logic voltage; transitioning a second bias voltage applied to a control input of the third transistor from a second relatively low voltage to a second relatively high voltage approximately when the output voltage begins transitioning from the second high logic voltage towards the low logic voltage; and transitioning the second bias voltage from the second relatively high voltage to the second relatively low voltage while the output voltage continues to transition from the second high logic voltage towards the second low logic voltage. [0014] Another aspect of the disclosure relates to an apparatus including means for coupling a first voltage rail to an output by turning on a first transistor and a second transistor coupled in series between the first voltage rail and the output in response to an input voltage transitioning from a first low logic voltage to a first high logic voltage; and means for decoupling a second voltage rail from the output by turning off a third transistor and a fourth transistor coupled in series between the output and the second voltage rail in response to the input voltage transitioning from the first low logic voltage to the first high logic voltage, wherein a voltage at the output transitions from a second low logic voltage towards a second high logic voltage in response to the coupling of the first voltage rail to the output and the decoupling of the second voltage rail from the output.

[0015] The apparatus further includes means for coupling the second voltage rail to the output by turning on the third transistor and the fourth transistor in response to the input signal transitioning from the first high logic voltage to the first low logic voltage; and means for decoupling the first voltage rail from the output by turning off the first transistor and the second transistor in response to the input signal transitioning from the first high logic voltage to the first low logic voltage, wherein the output voltage transitions from the second high logic voltage towards the second low logic voltage in response to the coupling of the second voltage rail to the output and the decoupling of the first voltage rail from the output.

[0016] Additionally, the apparatus includes means for transitioning a first bias voltage applied to a control input of the second transistor from a first relatively high voltage to a first relatively low voltage approximately when the output voltage begins transitioning from the second low logic voltage towards the second high logic voltage; means for transitioning the first bias voltage from the first relatively low voltage to the first relatively high voltage while the output voltage continues to transition from the second low logic voltage towards the second high logic voltage; means for transitioning a second bias voltage applied to a control input of the third transistor from a second relatively low voltage to a second relatively high voltage approximately when the output voltage begins transitioning from the second high logic voltage to the second low logic voltage; and means for transitioning the second bias voltage from the second relatively high voltage to the second relatively low voltage while the output voltage continues to transition from the second high logic voltage towards the second low logic voltage. To the accomplishment of the foregoing and related ends, the one or more embodiments include the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative aspects of the one or more embodiments. These aspects are indicative, however, of but a few of the various ways in which the principles of various embodiments may be employed and the description embodiments are intended to include all such aspects and their equivalents.

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG. 1A illustrates a schematic diagram of an exemplary input/output (I/O) driver in accordance with an aspect of the disclosure.

[0019] FIG. IB illustrates a timing diagram of exemplary signals relevant to the operation of the I/O driver of FIG. 1A in accordance with another aspect of the disclosure.

[0020] FIG. 1 C illustrates a graph of exemplary drain-to-source voltages (VDS) across respective buffer devices used in the I/O driver of FIG. 1A in accordance with another aspect of the disclosure.

[0021] FIG. 2A illustrates a schematic diagram of another exemplary input/output (I/O) driver in accordance with another aspect of the disclosure.

[0022] FIG. 2B illustrates a timing diagram associated with an exemplary operation of the I/O driver of FIG. 2A in accordance with another aspect of the disclosure.

[0023] FIG. 2C illustrates a timing diagram associated with another exemplary operation of the

I/O driver of FIG. 2A in accordance with another aspect of the disclosure.

[0024] FIG. 3A illustrates a schematic diagram of an exemplary gate bias voltage generator in accordance with another aspect of the disclosure.

[0025] FIG. 3B illustrates a timing diagram related to an exemplary operation of the gate bias voltage generator of FIG. 3 A in accordance with another aspect of the disclosure.

[0026] FIG. 4 illustrates a schematic diagram of an exemplary voltage generator in accordance with another aspect of the disclosure.

[0027] FIGs. 5A-5D illustrate schematic diagrams of exemplary first PMOS predriver, second

PMOS predriver, first NMOS predriver, and second NMOS predriver in accordance with another aspect of the disclosure.

[0028] FIG. 6 illustrates a flow diagram of an exemplary method of generating an output voltage based on an input voltage in accordance with another aspect of the disclosure.

DETAILED DESCRIPTION

[0029] The detailed description set forth below, in connection with the appended drawings, is intended as a description of various configurations and is not intended to represent the only configurations in which the concepts described herein may be practiced. The detailed description includes specific details for the purpose of providing a thorough understanding of the various concepts. However, it will be apparent to those skilled in the art that these concepts may be practiced without these specific details. In some instances, well-known structures and components are shown in block diagram form in order to avoid obscuring such concepts.

[0030] FIG. 1A illustrates a schematic diagram of an exemplary input/output (I/O) driver 100 in accordance with an aspect of the disclosure. The I/O driver 100 is configured to receive an input voltage VIN from, for example, a core circuit of an integrated circuit (IC). The input voltage VIN may swing between a high logic voltage and a low logic voltage according to a first or core voltage domain.

[0031] In response to the high and low voltages of the input voltage VIN, the I/O driver 100 generates an output voltage VPAD that swings between a high logic voltage and a low logic voltage according to a second or I/O voltage domain, respectively. As discussed in more detail below, the high and low logic voltages of the I/O voltage domain may swing substantially between VDDPX (applied to a first voltage rail) and Vss (applied to a second voltage rail). The I/O driver 100 provides the output voltage VPAD to a load coupled between the output and the second voltage rail (Vss)- The load may have a capacitance CLOAD.

[0032] In this example, the I/O driver 100 includes a pull-up circuit situated between a first voltage rail (VDDPX) and an output (VPAD)- The pull-up circuit is configured to couple the first voltage rail to the output to cause the output voltage VPAD at the output of the I/O device 100 to transition to and settle at a high logic voltage, such as substantially the voltage VDDPX at the first rail voltage (e.g., 3.6V).

[0033] The pull-up circuit is also configured to isolate or decouple the first voltage rail from the output of the I/O device 100 to allow the output voltage VPAD to transition to and settle at a low logic voltage, such as substantially a voltage Vss at a second rail voltage (e.g., 0V or ground). In this example, the pull-up circuit includes a pair of p-channel complementary metal oxide semiconductor (CMOS) field effect transistors (FETs) (hereinafter "PMOS") M _P11 and M _P12 , and resistor R _P . The PMOS M _P11 is responsive to a control signal V _P CTL for turning on and off the PMOS M _P11 in order to pull-up and isolate the output voltage V _P AD to and from the first rail voltage VDDPX, respectively.

[0034] The PMOS M _P i ₂ of the pull-up circuit may be biased with a substantially constant gate voltage V _P BIAS, which may be set to VDDPX/2 (e.g., 1.8V). Configured as such, the PMOS M _P i2 turns on and off in response to the turning on and off of PMOS M _P11 , respectively. For instance, when control voltage V _P CTL is substantially at a low logic voltage, such as VDDPX/2 (e.g., 1.8V), the PMOS M _P11 is turned on because its gate-to- source voltage (VGS) (e.g., 3.6V- 1.8V = 1.8V) is greater than the threshold voltage VT (e.g., 0.4V) of the device. The turning on of PMOS M _P11 causes VDDPX to be substantially applied to the source of PMOS M _P12 . Accordingly, PMOS M _P i ₂ turns on because its VGS (e.g., 3.6V-1.8V = 1.8V) is greater than its threshold voltage VT (e.g., 0.4V). Both PMOS M _P11 and M _P i ₂ being turned on causes VDDPX to be applied substantially to the output of the I/O driver 100 by way of resistor R _P , which causes the output voltage V _P AD to transition to and settle substantially at VDDPX (e.g., ~ 3.6V). The resistor R _P limits the current flow through the FETs M _P11 and M _P i ₂ to prevent overstressing or damaging of these devices.

[0035] Similarly, when control voltage V _P CTL is at a high logic voltage, such as substantially at VDDPX (e.g., +3.6V), the PMOS M _P11 is turned off because its V _G s (e.g., 3.6V-3.6V = 0V) is less than its threshold voltage V _T (e.g., 0.4V). The PMOS M _P11 being turned off isolates VDDPX from the source of PMOS M _P12 , which causes the voltage at the source of PMOS M _P i2 to decrease and settle at a voltage V _P i no greater than a threshold voltage above V _P BIAS (e.g., <2.2V). Thus, PMOS M _P i ₂ is turned off because its VGS does not exceed its threshold voltage VT. With both PMOS M _P11 and M _P i ₂ turned off, the output of the I/O driver 100 is substantially isolated from VDDPX, allowing a pull-down circuit of the I/O driver 100 to pull-down the output voltage V _P AD SO that it transitions to and settles at substantially Vss (e.g., 0V).

[0036] When the output voltage V _P AD is substantially at Vss, the PMOS M _P i ₂ prevents the entire voltage difference between VDDPX and Vss to be applied across PMOS M _P11 , thereby preventing overstressing or damage to device M _P11 . Instead, the voltage difference (VDDPX-VSS) is split, albeit unequally, across both PMOS M _P11 and M _P12 . Thus, PMOS M _Pi2 acts as a buffering device for PMOS M _P11 . [0037] The I/O driver 100 further includes a pull-down circuit situated between the output of the I/O driver 100 and the second voltage rail (Vss). The pull-down circuit is configured to couple the output to the second voltage rail to cause the output voltage VPAD to transition to and settle at a low logic voltage, such as substantially the steady- state second rail voltage Vss (e.g., ground). The pull-down circuit is also configured to isolate or decouple the output of the I/O device 100 from the second voltage rail to allow the output voltage VPAD to transition to and settle at a high logic voltage, such as substantially the first rail voltage VDDPX _. In this example, the pull-down circuit includes a pair of n-channel CMOS devices (hereinafter "NMOS") M _N n and M _N i2, and resistor RN. The NMOS M _N n is responsive to a control signal VNCTL for turning on and off the NMOS M II in order to couple and isolate the output to and from the second voltage rail, respectively.

[0038] The NMOS M _N i2 of the pull-down circuit may be biased with a substantially constant gate voltage VNBIAS, which may be set to VDDPX/2 (e.g., 1.8V). Configured as such, the NMOS MNI2 turns on and off in response to the turning on and off of NMOS MNII, respectively. For instance, when control voltage VNCTL is at a high logic voltage, such as VDDPX/2 (e.g., 1.8V), the NMOS M _N n is turned on because its V _G s (e.g., 1.8V-0V = 1.8V) is greater than its threshold voltage VT (e.g., 0.4V). The turning on of NMOS MNII causes Vss to be substantially applied to the source of NMOS M _N i2- In response, NMOS M _N i2 turns on because its V _G s (e.g., 1.8V-0V = 1.8V) is greater than its threshold voltage VT (e.g., 0.4V). Both NMOS M _N n and M _N i2 being turned on causes Vss to be applied substantially to the output of the I/O driver 100 by way of resistor RN, which results in the output voltage VPAD to transition to and settle substantially at the second rail voltage Vss (e.g., 0V). The resistor R _N limits the current flow through the devices M _N n and M _N i2 to prevent overstressing or damaging of the devices.

[0039] Similarly, when control voltage VNCTL is at a low logic voltage, such as Vss (e.g., 0V), the NMOS MNII is turned off because its V _G s (e.g., 0V-0V = 0V) is less than its threshold voltage VT (e.g., 0.4V). The device NMOS M _N n being turned off isolates Vss from the source of NMOS MNI ₂ , which causes the source of NMOS MNI2 to decrease and settle to no more than a threshold voltage below VNBIAS (e.g., >1.4V). Accordingly, NMOS M _N i2 is turned off because its VGS does not exceed its threshold voltage VT. Both NMOS MNII and M _N i2 being turned off decouple the output from the second voltage rail, thereby allowing the pull-up circuit to cause the output voltage V _P AD to transition to and settle at the high logic voltage, such as substantially at the first rail voltage VDDPX (e.g., +3.6V).

[0040] When the output voltage VPAD is at VDDPX, the NMOS M _N i2 prevents the entire voltage difference between VDDPX and Vss to be applied across NMOS M _N n, thereby preventing overstressing or damage to device M _N n. Instead, the voltage difference (VDDPX-VSS) is split, albeit unequally, across both NMOS Mp^ and MNII. Thus, NMOS MNI2 acts as a buffering device for NMOS M _N n.

[0041] Note that the respective logic voltages pertaining to the output voltage VPAD, the control VpcTL voltage, and the VNCTL gate voltage are in different voltage domains. For instance, the high and low logic voltages pertaining to the VPAD voltage domain vary between substantially VDDPX (e.g., 3.6V) and Vss (e.g., 0V). The high and low logic voltages pertaining to the VPCTL voltage domain vary between substantially VDDPX (e.g., 3.6V) and VDDIX (e.g., 1.8V). And, the high and low logic voltages pertaining to the VNCTL voltage domain vary between substantially VDDK (e.g., 1.8V) and Vss (e.g., 0V).

[0042] FIG. IB illustrates a timing diagram of exemplary signals relevant to the operation of the exemplary I/O driver 100 in accordance with another aspect of the disclosure. The x- or horizontal axis of the timing diagram represents time, and is divided into four states or time intervals: (1) when the output voltage VPAD of the I/O driver 100 is at a steady-state high logic voltage VDDPX, which is indicated in the left-most and right-most columns of the timing diagram; (2) when the output voltage VPAD is transitioning from the high logic voltage VDDPX to a low logic voltage Vss, which is indicated in the second column from the left; (3) when the output voltage VPAD is at a steady-state low logic voltage Vss, which is indicated in the third column from the left; and (4) when the output voltage VPAD is transitioning from the low logic voltage Vss to the high logic voltage VDDPX, which is indicated in the fourth column from the left.

[0043] The y- or vertical axis of the timing diagram represents the various voltages of the I/O driver 100. For instance, from top to bottom, the voltages are: (1) the control voltage VPCTL for PMOS M _P11 ; (2) the gate bias voltage VPBIAS for PMOS M _P i ₂ ; (3) the voltage Vpi at the source of PMOS M _P i ₂ ; (4) the output voltage V _PAD of the I/O driver 100; (5) the gate bias voltage VNBIAS for NMOS M _N i ₂ ; (6) the voltage VNI at the source of NMOS M _Ni2 ; and (7) the control voltage VNCTL for NMOS M _N n. [0044] In operation, during the state or time interval where the output voltage V _P AD of the I/O driver 100 is at a steady-state high logic voltage VDDPX as indicated in the left-most column of the timing diagram, the control voltage VPCTL is at a low logic voltage VDDIX (e.g., 1.8V) and the gate bias voltage VPBIAS is at a constant VDDPX/2 voltage (e.g., 1.8V) in order to turn on both PMOS M _P n and Mp ₁₂ , respectively. The turning on of both PMOS Mpn and M _P i ₂ results in substantially applying VDDPX to the output of the I/O driver 100, thereby causing the output voltage VPAD to be at the high logic voltage VDDPX (e.g., 3.6V). Also, the voltage Vpi at the source of PMOS M _P i ₂ is substantially at VDDPX (e.g., 3.6V). Further, during this state or time interval, the control voltage VNCTL is at a low logic voltage Vss (e.g., 0V) to turn off NMOS M _N n. The gate bias voltage VNBIAS for NMOS M _m2 is at the constant V _DD px/2 voltage (e.g., 1.8V). With NMOS MNII being turned off, the voltage VNI at the source of NMOS M _N i2 settles to no more than a threshold voltage below VNBIAS, for example, to VNBIAS-VT (e.g., 1.4V). Thus, both NMOS MNII and M _N i2 are turned off to isolate or decouple the output of the I/O driver 100 from Vss-

[0045] During the state or time interval where the output voltage VPAD of the I/O driver 100 is transitioning from the high logic voltage VDDPX to the low logic voltage Vss as indicated in the second column from the left, the control voltage VPCTL for PMOS Mpn is raised to the high logic voltage VDDPX (e.g., 3.6V) to turn off PMOS Mp . The gate bias voltage VPBIAS of PMOS M _P i ₂ remains at the constant VDDPX/2 (e.g., 1.8V). Thus, the voltage VPI at the source of PMOS M _P i ₂ decreases and settles to no more than a threshold voltage above VPBIAS, for example, to VPBIAS+VT (e.g., 2.2V). Thus, both PMOS Mpn and M _P i ₂ are turned off to isolate or decouple the output of the I/O driver 100 from VDDPX- Also, during this state or time interval, the control voltage VNCTL is raised to a high logic voltage VDDIX (e.g., 1.8V) to turn on NMOS M _N n. The turning on of NMOS MNII causes the voltage VNI at the source of NMOS M _N i ₂ to decrease to substantially Vss (e.g., 0V). The gate bias voltage of NMOS M _N i ₂ remains at VDDPX/2 (e.g., 1.8V). Thus, the gate-to-source voltage VGS of NMOS M _N i ₂ is greater than its threshold voltage V _T , thereby causing NMOS M _N i ₂ to turn on. Both NMOS M _N n and M _N i ₂ being turned on cause the output voltage VPAD to transition to and settle substantially at Vss (e.g., 0V). [0046] Once the voltages have transitioned, they will remain substantially constant during the state or time interval where the output voltage VPAD is at substantially Vss, as indicated in the third column from the left. That is, the voltage VPCTL is at the high logic voltage VDDPX and VPBIAS is at VDDPX/2 to keep devices M _P n and M _P i ₂ turned off to isolate or decouple the output from the first voltage rail (VDDPX)- The voltage Vpi at the source of PMOS Mpi2 remains substantially constant at no more than a threshold voltage VT above VPBIAS (e.g., 2.2V). The voltage VNCTL is at the high logic voltage VDDIX and voltage VNBIAS is at the constant VDDPX/2 to keep both devices M _N n and M _N i2 turned on to cause the output voltage VPAD to be at the low logic voltage Vss- Both devices M _N n and M _N i2 being turned on cause the voltage VNI at the source of NMOS M _N i2 to be at Vss (e.g., 0V).

[0047] During the state or time interval where the output voltage VPAD of the I/O driver 100 is transitioning from the low logic voltage Vss to the high logic voltage VDDPX as indicated in the fourth column from the left, the control voltage VPCTL for PMOS M _P n is lowered to the low logic voltage VDDIX (e.g., 1.8V) to turn on PMOS Mpn. The gate bias voltage VPBIAS for PMOS M _P i ₂ remains at the constant VDDPX/2 (e.g., 1.8V). Thus, both PMOS Mpn and M _P i ₂ turn on. Accordingly, the voltage V _P i at the source of PMOS Mpi2 as well as the output voltage VPAD transition to the high logic voltage VDDPX (e.g., 3.6 V). Also, during this state or time interval, the control voltage VNCTL is lowered to the low logic voltage Vss (e.g., 0V) to turn off NMOS M _N n. The gate bias voltage VNBIAS of NMOS M _N i2 remains at the constant VDDPX/2 (e.g., 1.8V). Accordingly, the voltage VNI at the source of NMOS MNI2 increases to at least a threshold voltage below VNBIAS, to, for example, 1.4V. Thus, the gate-to-source voltage VGS of NMOS M _N i2 does not exceed its threshold voltage VT, thereby causing NMOS M _N i2 to turn off. Both NMOS MNII and M _N i2 being turned off isolate or decouple the output voltage VPAD from Vss (e.g., 0V). Once the voltages have transitioned, they will remain substantially constant during the state or time interval where the output voltage VPAD is at the high logic voltage VDDPX, as indicated in the right-most column.

[0048] There are a couple of issues with the I/O driver 100. For instance, if the devices Mpn, Mpi2, MNII, and M _N i2 used in I/O driver 100 are manufactured in accordance with 45nm, 40nm or 28nm technology (e.g., to use the same technology for all other non-I/O devices (e.g., core devices) in an integrated circuit), the maximum reliability voltage across any terminals (V _G s, VGD, and V _D s) of these devices is about 2.0V. If the devices are exposed to voltages above the reliable limit of 2.0V and for an extended period of time (e.g., a few picoseconds or more), recoverable or unrecoverable damage to these devices may result. Such damage may be due to negative bias temperature instability (NBTI) or hot carrier injection (HCI). As a consequence, the performance and functionality of the devices may degrade or completely fail.

[0049] With reference again to FIG. IB, when the output voltage VPAD is at the high logic voltage VDDPX as indicated in the left-most and right-most columns of the timing diagram, the voltage at the drain of NMOS M _N i2 is substantially at VDDPX (e.g., 3.6V) and the voltage at the source of NMOS M _N i2 is at 1.4V. Thus, the voltage difference (e.g., VDS) across the drain and source of NMOS M _N i2 is 2.2V. As previously discussed, this voltage differential of 2.2V across NMOS M _N i2 exceeds the reliability limit of +2.0V if this device is manufactured in accordance with a particular implementation.

[0050] Further, during the state or time interval where the output voltage VPAD is transitioning from VDDPX to Vss as indicated in the second column from the left, the voltage VNI at the source of NMOS M _N i2 decreases from 1.4V to 0V at a rate much faster than the output voltage VPAD decreases from 3.6V to 0V, due to generally a larger load present at the output of the I/O driver 100. As a result, the voltage difference VDS across the drain and source of NMOS M _N i2 increases up to about 2.8V during the transition of the output voltage VPAD from VDDPX to Vss, again exceeding the reliability limit of 2.0V if the device is manufactured in accordance with a particular implementation.

[0051] Similarly, when the output voltage VPAD is at the low logic voltage Vss as indicated in the third column from the left, the voltage at the drain of the PMOS M _P i ₂ is substantially at Vss (e.g., 0V) and the voltage at the source of the PMOS M _P i ₂ is at 2.2V. Thus, the voltage difference (e.g., VDS) across the drain and source of PMOS M _P i ₂ is 2.2V. As previously discussed, this voltage differential of 2.2V across PMOS M _P i ₂ exceeds the reliability limit of 2.0V if this device is manufactured in accordance with a particular implementation.

[0052] Also, similarly, during the state or time interval where the output voltage VPAD is transitioning from Vss to VDDPX as indicated in the fourth column from the left, the voltage Vpi at the source of PMOS M _P i ₂ increases from 2.2V to 3.6V at a rate much faster than the output voltage VPAD increases from 0V to 3.6V due to generally a larger load present at the output of the I/O driver 100. As a result, the voltage differential VDS across the drain and source of PMOS M _P i ₂ increases up to about 2.8V during the transition of the output voltage VPAD from Vss to VDDPX, again exceeding the reliability limit of 2.0V if the device is manufactured in accordance with a particular implementation.

[0053] FIG. 1C illustrates a graph of exemplary voltages (VDS) across respective devices Mp^ and M _N i2 used in the exemplary I/O driver 100 in accordance with another aspect of the disclosure. When the output voltage VPAD is substantially at steady-state VDDPX (e.g., 3.6V), which occurs in this graph between 6 nanoseconds (ns) and 10ns, the voltage difference (VDS) across the drain and source of NMOS M _N i2 is approximately at 2.2V, which exceeds the reliability limit of 2.0V for a 45nm, 40nm or 28nm technology device. Also, during the transition of the output voltage VPAD from VDDPX to Vss (e.g., from 3.6V to 0V), which occurs in this graph between 10ns and 11ns, the voltage difference (VDS) across the drain and source of NMOS MNI2 spikes up to approximately 2.8V, which substantially exceeds the reliability limit of 2.0V for a device manufactured with a particular implementation.

[0054] Similarly, when the output voltage VPAD is substantially at steady-state Vss (e.g., 0V), which occurs in this graph between 11ns and 15ns, the voltage difference (VDS) across the drain and source of PMOS M _P i ₂ is approximately at 2.2V, which exceeds the reliability limit of 2.0V for a 45nm, 40nm or 28nm technology device. Also, during the transition of the output voltage VPAD from Vss to VDDPX, which occurs in this graph between 15ns and 16ns, the voltage difference (VDS) across the drain and source of PMOS Mpi2 spikes up to approximately 2.8V, which substantially exceeds the reliability limit of 2.0V for a device manufactured with a particular implementation.

[0055] Thus, there is a need to implement lower voltage devices, such as those manufactured in accordance with 45nm, 40nm or 28nm technology, for I/O driver operations, while controlling the voltages across the devices so as to not exceed their reliability limits. A discussion of an exemplary I/O driver that achieves at least this end is provided below.

[0056] FIG. 2A illustrates a schematic diagram of an input/output (I/O) driver 200 in accordance with another aspect of the disclosure. One of the differences between I/O driver 200 and I/O driver 100 is that the bias voltages V BIAS and VPBIAS are not constant, but change during transitions of the output voltage V _P AD from high-to-low logic voltages and from low-to-high logic voltages, respectively. This is done to reduce the maximum voltages across the buffer devices M _N 22 and M _P2 2 to below their reliability limits during transitions of the output voltage VPAD, respectively. Additionally, the I/O driver 200 applies bias voltages to the sources of M _N 22 and M _P2 2 to prevent over-voltage of such devices when the output voltage VPAD is at steady-state high and low logic voltages, respectively.

[0057] As an overview, the I/O driver 200 is configured to receive an input voltage VTN from, for example, a core circuit of an IC. The input voltage VIN may swing between high and low logic voltages according to a first (e.g., core) voltage domain. In response to the high and low voltages of the input voltage VIN, the I/O driver 200 generates an output voltage VPAD that swings between high and low logic voltages according to a second (e.g., "I/O") voltage domain, respectively. The high and low logic voltages of the second voltage domain may coincide substantially with VDDPX and Vss- The I/O driver 200 provides the output voltage VPAD to a load having a capacitance CLOAD-

[0058] More specifically, the I/O driver 200 includes a pull-up circuit having PMOS M _P2 i and Mp22 coupled in series between a first voltage rail (VDDPX) and the output (VPAD) of the I/O driver. Similarly, the I/O driver 200 includes a pull-down circuit including NMOS M _N 22 and M _N 2i coupled in series between the output (VPAD) and a second voltage rail (Vss).

[0059] The I/O driver 200 further includes a first PMOS predriver 210 configured to generate a voltage signal VPCTL HV in response to an input signal VIN. The voltage domain for VpcTL Hv varies between a low logic voltage VDDIX (e.g., VDDPX/2) and a high logic voltage VDDPX- The I/O driver 200 further includes a second PMOS predriver 211 configured to generate a voltage signal VPNCTL LV ^m response to an input signal VIN. The voltage domain for VPCTL LV varies between a low logic voltage Vss and a high logic voltage VDDIX- Thus, when the input voltage VIN is low, VPCTL HV is at VDDPX and VPCTL LV is at VDDIX- When the input voltage VIN is high, VPCTL HV is at VDDTX and VPCTLHV is at Vss-

[0060] Similarly, the I/O driver 200 further includes a first NMOS predriver 220 configured to generate a voltage signal VNCTL LV i ⁿ response to the input signal VIN- The voltage domain for VNCTL LV varies between a low logic voltage Vss and a high logic voltage VDDIX- The I/O driver 200 further includes a second NMOS predriver 221 configured to generate a voltage signal VNCTL HV ^m response to the input signal VTN- The voltage domain for VNCTL HV varies between a low logic voltage VDDIX and a high logic voltage VDDPX- Thus, when the input voltage VIN is low, VNCTL LV is at VDDIX and VNCTL HV is at VDDPX- When the input voltage VIN is high, VNCTL LV is at Vss and VNCTL HV is at VDDIX-

[0061] The signal VPCTL HV generated by the first PMOS predriver 210 is applied to the gate of PMOS M _P21 and to a Vpi voltage generator 214. The signal VPCTL LV generated by the second PMOS predriver 211 is applied to a VPBIAS voltage generator 212. Similarly, the signal V _N CTL_LV generated by the first NMOS driver 220 is applied to the gate of NMOS M _N 2i and to a VNI voltage generator 224. The signal VNCTL HV generated by the second NMOS predriver 221 is applied to a VNBIAS voltage generator 222.

[0062] The VPBIAS voltage generator 212 is configured to generate a bias voltage VPBIAS based on VPCTL LV and VPAD- The bias voltage VPBIAS is applied to the gate of PMOS M _P2 2. Similarly, the VNBIAS voltage generator 222 is configured to generate a bias voltage VNBIAS based on VNCTL HV and VPAD- The bias voltage VNBIAS is applied to the gate of NMOS MN22-

[0063] The VPI voltage generator 214 is configured to generate a defined voltage VPI based on VPCTL HV and VPAD _. The defined voltage VPI is applied to the source of PMOS M _P2 2- The defined voltage VPI protects the PMOS M _P2 2 from over-voltage when the output voltage VPAD is at a steady-state low logic voltage. For example, when the output voltage VPAD is at the steady-state low logic voltage Vss (e.g., 0V), the defined voltage VPI is substantially at VDDIX (e.g., 1.8V). Due to the defined voltage VPI, the drain-to- source voltage VDS of PMOS M _P22 is, for example, 1.8V, below a reliability maximum voltage of 2.0V for certain device technology.

[0064] Similarly, the VNI voltage generator 224 is configured to generate a defined voltage VNI based on VNCTL LV and VPAD _. The defined voltage VNI is applied to the source of NMOS M _N22 . The defined voltage VNI protects the NMOS M _N22 from over-voltage when the output voltage VPAD is at a steady-state high logic voltage. For example, when the output voltage VPAD is at the steady-state high logic voltage VDDPX (e.g., 3.6V), the defined voltage VNI is substantially at VDDIX (e.g., 1.8V). Due to the defined voltage VNI, the drain-to-source voltage VDS of NMOS M _N 22 is, for example, 1.8V, below a reliability maximum voltage of 2.0V for certain device technology.

[0065] FIG. 2B illustrates a timing diagram associated with an exemplary operation of the I/O driver 200 in accordance with another aspect of the disclosure. For explanation purposes, VDDPX is 3.6V, VDDK is 1.8V, and Vss is 0V. Also, for explanation purposes, the maximum reliability voltage for VDS, VGS, and VDG of devices M _P2 i, M _P2 2, M _N 22, and MN2I is 2.0V. It shall be understood that such voltages and maximum reliability voltages may be different in various implementations based on the type of devices and applications used for the I/O driver 200.

[0066] Similar to the graph of FIG. IB, the x- or horizontal axis of the timing diagram represents time, and is divided into four states or time intervals: (1) when the output voltage VPAD of the I/O driver 200 is at a steady-state high logic voltage VDDPX, which is indicated in the right-most and left-most columns of the timing diagram; (2) when the output voltage VPAD is transitioning from the high logic voltage VDDPX to a low logic voltage Vss, which is indicated in the second column from the left; (3) when the output voltage VPAD is at a steady-state low logic voltage Vss, which is indicated in the third column from the left; and (4) when the output voltage VPAD is transitioning from the low logic voltage Vss to the high logic voltage VDDPX, which is indicated in the fourth column from the left.

[0067] The y- or vertical axis of the timing diagram represents the various voltages of the I/O driver 200. For instance, from top to bottom, the voltages are: (1) the control voltage VpcTL_Hv for PMOS M _P11 ; (2) the defined voltage V _P i at the source of PMOS M _P i ₂ ; (3) the gate bias voltage VPBIAS for PMOS M _P i ₂ ; (4) the output voltage VPAD; (5) the gate bias voltage VNBIAS for NMOS M _N i ₂ ; (6) the defined voltage V _N i at the source of NMOS M _Ni2 ; and (7) the control voltage V _N CTL_LV for NMOS M _N n.

[0068] When the output voltage VPAD is at a high logic voltage VDDPX (3.6V) as indicated by the left-most and right-most columns, the control voltage VPCTL HV is at a low logic voltage VDDK (1.8V) to turn on PMOS M _P2 i, the defined voltage Vpi at the source of PMOS Mp22 is at VDDPX (3.6V), and the bias voltage VPBIAS is at a relatively high voltage VDDK (1.8V), which causes PMOS M _P2 2 to turn on in response to PMOS M _P2 i turning on. Accordingly, the output voltage VPAD is at a high logic voltage VDDPX (3.6V) due to the first voltage rail being coupled to the output via the turned-on PMOS

Mp2i and M _P2 2.

[0069] Also, when the output voltage VPAD is at the high logic voltage VDDPX (3.6V), the control voltage VNCTL LV is at a low logic voltage Vss (0V) to turn off NMOS M _N 2i, the defined voltage VNI is at VDDIX (1.8V) to maintain the VDS of NMOS M _N 22 below its reliability limit, and the bias voltage VNBIAS is at a relatively low voltage VDDIX (1.8V) to turn off NMOS MN22- Accordingly, the output is decoupled from the second voltage rail (Vss) due to the turned-off NMOS M _N22 and M _N2 i.

[0070] To transition the output voltage VPAD from the high logic voltage VDDPX (3.6V) towards the low logic voltage Vss (0V) as indicated in the second column from the left, the control voltage VNCTL LV is changed from the low logic voltage Vss (0V) to the high logic voltage VDDEX (1.8V) to turn on NMOS M _N 2i- Simultaneous with VNCTL LV changing from low to high, the bias voltage VNBIAS is raised from a relatively low bias voltage (e.g., -VDDIX (1.8V)) to a relatively high bias voltage (e.g., -VDDPX (3.6V)). This is done to configure the respective tum-on resistances of NMOS MN2I and MN22 to be more equalized (e.g., substantially the same) when the output voltage VPAD initially transitions from high-to-low. This causes the 3.6V voltage drop between VPAD and Vss to be equally divided among NMOS M _N 22 and M _N 2i; thus, causing the devices to each see a voltage drop of substantially 1.8V, which is below the 2.0V reliability limit.

[0071] When the output voltage VPAD has decreased to a defined voltage level, the bias voltage VNBIAS is brought back to the relatively low bias voltage (e.g., -VDDIX (1.8V)). The time interval in which the VNBIAS is at the relatively high bias voltage (e.g., -VDDPX (3.6V)) should be controlled to prevent over-voltage of NMOS M _N 22- For instance, if the time interval is too short, then NMOS M _N 22 may be subjected to over-voltage due to its VDS being above the reliability limit. If, on the other hand, the time interval is too long, then the device M _N 22 may be subjected to over-voltage due to its gate-to-source voltage (VGS) and/or gate-to-drain voltage (VGD) being above the reliability limit.

[0072] The time interval depends on the rate at which the output voltage VPAD decreases from VDDPX to Vss- Such rate depends on the capacitive load CLOAD coupled to the output of the I/O driver 200. If the capacitance CLOAD of the load is relatively small, then the time interval should be relatively short because the rate at which output voltage VPAD is decreasing is relatively high. If the capacitance CLOAD of the load is relatively large, then the time interval should be relatively long because the rate at which output voltage VPAD is decreasing is relatively low. Accordingly, the V BIAS voltage generator 222 generates the raised VNBIAS voltage based on the rate at which output voltage VPAD transitions from high-to-low.

[0073] Further, to facilitate the transition of the output voltage VPAD from the high logic voltage VDDPX (3.6V) towards the low logic voltage Vss (OV), the control voltage VpcTL Hv is changed from the low logic voltage VDDIX (1.8V) to the high logic voltage VDDPX (3.6V) to turn off PMOS Mp ₂₁ . In response to the output voltage VPAD decreasing to a defined voltage level, the Vpi voltage generator 214 generates a defined voltage VPI substantially at VDDIX (1.8V). As the bias voltage VPBIAS applied to gate of PMOS Mp22 is maintained constant at VDDEX (1.8V) during the transition of the output voltage VPAD from high-to-low, PMOS M _P2 2 turns off because its VGS is substantially at OV. Accordingly, during the transition of the output voltage VPAD from high-to-low, the pull-up circuit decouples the output from the first voltage rail (VDDPX) due to the turned off PMOS Mp ₂₁ and Mp22.

[0074] When the output voltage VPAD is at a steady-state low logic voltage Vss (0V) as indicated in the third column from the left, the control voltage VNCTL LV is at the high logic voltage VDDIX (1.8V) to maintain NMOS M _N 2i turned on, the bias voltage VNBIAS is at a low bias voltage VDDIX (1.8V) (relative compared to VDDPX), which maintains NMOS M _N 22 turned on. Thus, output voltage VPAD receives Vss (0V) from the second voltage rail via the turned-on NMOS M _N 2i and M _N 22- It follows that the defined voltage VNI is also at Vss (0V).

[0075] Also, when the output voltage VPAD is at the steady-state low logic voltage Vss (0V), the bias voltage VPCTL HV is at a high logic voltage VDDPX (3.6V) to maintain PMOS M _P21 turned off, the defined voltage VPI is at VDDIX (1.8V) to protect PMOS M _P2 2 from over- voltage as discussed, and the bias voltage VPBIAS is at a high bias voltage VDDIX (1.8V) (compared to Vss), which maintains PMOS M _P2 2 turned off. Thus, the output of the I/O driver 200 is decoupled from the first voltage rail (VDDPX) via the turned-off PMOS Mp2i and Mp22.

[0076] To transition the output voltage VPAD from the low logic voltage Vss (0V) towards the high logic voltage VDDPX (3.6V) as indicated in the fourth column from the left, the control voltage VPCTL HV is changed from the high logic voltage VDDPX (3.6V) to the low logic voltage V _DD ix (1.8V) to turn on PMOS M _P21 . Simultaneous with V _P CTL_HV changing from high to low, the bias voltage VPBIAS is lowered from the relatively high bias voltage (e.g., -VDDIX (1.8V)) to a relatively low bias voltage (e.g., Vss (0V)). This is done to configure the respective turn-on resistances of PMOS M _P2 i and M _P2 2 to be more equalized (e.g., substantially the same) when the output voltage VPAD initially transitions from low-to-high. This causes the 3.6V voltage drop between VDDPX and VPAD to be divided equally among PMOS Mp22 and Mp ₂₁ ; thus, causing the devices to each see a voltage drop of substantially 1.8V, which is below the 2.0V reliability limit.

[0077] When the output voltage VPAD has increased to a defined voltage level, the bias voltage VPBIAS is brought back to the relatively high bias voltage (e.g., -VDDIX (1.8V)). The time interval in which the VPBIAS is at the relatively low bias voltage (e.g., -Vss (0V)) should be controlled to prevent over-voltage of PMOS M _P2 2. For instance, if the time interval is too short, then PMOS M _P2 2 may be subjected to over-voltage due to its VDS being above the reliability limit. If, on the other hand, the time interval is too long, then the device Mp ₂₂ may be subjected to over-voltage due to its gate-to-source voltage (VGS) and/or gate-to-drain (VGD) being above the reliability limit.

[0078] The time interval depends on the rate at which the output voltage VPAD increases from Vss to VDDPX- Such rate depends on the capacitive load CLOAD coupled to the output of the I/O driver 200. If the capacitance CLOAD of the load is relatively small, then the time interval should be relatively short because the rate at which output voltage VPAD is increasing is relatively high. If the capacitance CLOAD of the load is relatively large, then the time interval should be relatively long because the rate at which output voltage VPAD is increasing is relatively low. Accordingly, the VPBIAS voltage generator 212 generates the lowered VPBIAS voltage based on the rate at which output voltage VPAD transitions from low-to-high.

[0079] Further, to facilitate the transition the output voltage VPAD from the low logic voltage Vss (0V) towards the high logic voltage Vss (3.6V), the control voltage VNCTL LV is changed from the high logic voltage VDDIX (1.8V) to the low logic voltage Vss (0V) to turn off NMOS MN ₂ I. In response to the output voltage VPAD increasing to a defined voltage level, the VNI voltage generator 224 generates a defined voltage VNI substantially at VDDIX (1.8V). As the bias voltage VNBIAS applied to gate of NMOS M _N22 is maintained constant at VDDIX (1.8V) during the transition of the output voltage VPAD from low-to-high, NMOS M _N 22 turns off because its VGS is substantially at 0V. Accordingly, during the transition of the output voltage VPAD from low-to-high, the pull-down circuit decouples the output from the second voltage rail (Vss) due to the turned off NMOS M _N2 i and M _N22 .

[0080] FIG. 2C illustrates a timing diagram associated with another exemplary operation of the I/O driver 200 in accordance with another aspect of the disclosure. The I/O driver 200 may be configured as a tristate device, where the I/O driver may produce a high logic voltage, a low logic voltage, or high impedance at its output. Accordingly, the timing diagram depicted in FIG. 2C relates to the operation of the I/O driver 200 when it produces a high impedance at its output.

[0081] As illustrated in FIG. 2A, the first and second PMOS predrivers 210 and 211, and the first and second NMOS predrivers 220 and 221 each receive an enable (EN) signal. When the EN signal is asserted, the I/O driver 200 operates to output a high logic voltage or low logic voltage based on the input voltage VTN, as previously discussed. When the EN signal is not asserted, the I/O driver 200 is configured to produce high impedance at the output to allow other one or more external devices to drive a transmission line or load coupled to the output. The I/O driver 200 produces the high impedance at its output by turning off the pull-up circuit (e.g., turning off PMOS M _P2 i and M _P22 ) and the pull-down circuit (e.g., turning off NMOS M _N22 and M _N2 i).

[0082] More specifically, when the EN signal is not asserted, the first PMOS predriver 210 generates the control voltage VPCTL HV at the high logic voltage VDDPX (3.6V) and the second PMOS predriver 211 generates the control voltage VPCTL LV at the high logic voltage VDDK (1.8V) regardless of the logic state of the input voltage VIN and the output voltage VPAD- The control voltage VPCTL HV being maintained at the high logic voltage VDDPX (3.6V) maintains PMOS M _P2 i turned off while the I/O driver 200 is operated to produce high impedance at the output. The control voltage VPCTL LV being at the high logic voltage VDDTX (1.8V) causes the VPBIAS voltage generator 212 to generate the bias voltage VPBIAS at a constant relatively high bias voltage VDDTX (1.8V). The timing diagram of FIG. 2C depicts VPCTL HV and VPCTL LV at constant voltages VDDPX (3.6V) and VDDK (1.8V) while the I/O driver 200 is configured to output a high impedance.

[0083] Similarly, when the EN signal is not asserted, the first NMOS predriver 220 generates the control voltage VNCTL LV at the low logic voltage Vss (0V) and the second NMOS predriver 221 generates the control voltage VNCTL HV at the l° ^w logic voltage VDDIX (1.8 V) regardless of the logic state of the input voltage VIN and the output voltage VPAD. The control voltage VNCTL LV being maintained at the low logic voltage Vss (0V) maintains NMOS M _N 2i turned off while the I/O driver 200 is operated to produce a high impedance at the output. The control voltage VNCTL HV being at the low logic voltage VDDIX (1.8V) causes the VNBIAS voltage generator 212 to generate the bias voltage VNBIAS at a constant relatively low bias voltage VDDIX (1.8V). The timing diagram of FIG. 2C depicts both VNCTL LV and VNCTL HV at constant voltages Vss (0V) and VDDIX (1.8V) while the I/O driver 200 is configured to output a high impedance.

[0084] The control voltage VPCTL HV being at the constant high logic voltage VDDPX (3.6V) causes the Vpi voltage generator 214 to generate the defined voltage Vpi to maintain PMOS Mp22 turned off and protected from over-voltage while the I/O driver 200 is configured to output a high impedance. For instance, when the output voltage VPAD is driven to a high logic voltage VDDPX (3.6V) by another device, the VPI voltage generator 214 generates the defined voltage Vpi at VDDPX (3.6V), as illustrated in the timing diagram of FIG. 2C. Thus, PMOS M _P22 is effectively turned off as its V _D s is 0V and the maximum voltage across PMOS M _P2 2 is VGS and VGD at 1.8V, which is below the reliability limit of 2.0V for certain device technology. When the output voltage VPAD is driven to a low logic voltage Vss (0V) by another device, the VPI voltage generator 214 generates the defined voltage VPI at VDDEX (1.8V), as illustrated in the timing diagram of FIG. 2C. Thus, the maximum voltage across PMOS M _P2 2 is VDS 1.8V, which is also below the reliability limit of 2.0V for certain device technology.

[0085] The control voltage VNCTL LV being at the constant low logic voltage Vss (0V) causes the VNI voltage generator 224 to generate the defined voltage VNI to maintain NMOS M _N 22 turned off and protected from over-voltage while the I/O driver 200 is configured to output a high impedance. For instance, when the output voltage VPAD is driven to a low logic voltage Vss (0V) by another device, the VNI voltage generator 224 generates the defined voltage VNI at Vss (0V), as illustrated in the timing diagram of FIG. 2C. Thus, NMOS Mp22 is effectively turned off as its VDS is 0V and the maximum voltage across NMOS M _N 22 is VGS and VGD at 1.8V, which is below the reliability limit of 2.0V for certain device technology. When the output voltage VPAD is driven to a high logic voltage VDDPX (3.6V) by another device, the VNI voltage generator 224 generates the defined voltage V _N i at VDDK (1.8V), as illustrated in the timing diagram of FIG. 2C. Thus, the maximum voltage across NMOS M _N 22 is VDS 1.8V, which is also below the reliability limit of 2.0V for certain device technology.

[0086] FIG. 3A illustrates a schematic diagram of an exemplary bias voltage generator 300 including a VNBIAS voltage generator 310 and a VPBIAS voltage generator 320. The VNBIAS voltage generator 310 and the VPBIAS voltage generator 320 may be one exemplary detailed implementation of VNBIAS voltage generator 222 and VPBIAS voltage generator 212 of I/O driver 200, respectively.

[0087] In particular, the VNBIAS voltage generator 310 includes a PMOS M _P31 , a PMOS M _P32 , a NAND gate 312, and an inverter 314. The PMOS M _P3 i includes source and drain coupled between the output (VPAD) of the I/O driver 200 and a first input of the NAND gate 312. The gate of PMOS M _P3 i is configured to receive the constant bias voltage VDDIX- The PMOS M _P32 includes source and drain coupled between a source of the constant bias voltage VDDIX and the first input of the NAND gate 312. The gate of M _P32 is coupled to the output (VPAD) of the I/O driver 200. The control voltage VNCTL HV is applied to a second input of the NAND gate 312. The output of the NAND gate 312 is coupled to an input of the inverter 314. The bias voltage VNBIAS is generated at the output of the inverter 314.

[0088] The V _PB IAS voltage generator 320 includes an NMOS M _N31 , an NMOS M _N32 , a NOR gate 322, and an inverter 324. The NMOS M _N31 includes drain and source coupled between the output (VPAD) of the I/O driver 200 and a first input of the NOR gate 322. The gate of NMOS MN ₃ I is configured to receive the constant bias voltage VDDIX- The NMOS M _N3 2 includes source and drain coupled between the source of the constant bias voltage VDDIX and the first input of the NOR gate 322. The gate of M _N3 2 is coupled to the output (VPAD) of the I/O driver 200. The control voltage VPCTL LV is applied to a second input of the NOR gate 322. The output of the NOR gate 322 is coupled to an input of the inverter 324. The bias voltage VPBIAS is generated at the output of the inverter 324.

[0089] The circuit including PMOS M _{P3 i} and M _P32 and NMOS M _N3 i and M _N3 2 operate as a waveform splitter. That is, as discussed, the voltage domain for the output voltage VPAD has high and low logic voltages at VDDPX and Vss, respectively. The portion of the waveform splitter having PMOS M _P3 i and M _P32 generates the signal VPAD HV that tracks the high and low logic voltages of the output voltage V _P AD but in a different voltage domain having high and low voltages at VDDPX and VDDIX, respectively. Similarly, the portion of the waveform splitter having NMOS M _N 3 i and M _N 32 generates the signal VPAD LV that tracks the high and low logic voltages of the output voltage VPAD but in a different voltage domain having high and low voltages at VDDIX and Vss, respectively.

[0090] FIG. 3B illustrates a timing diagram related to exemplary operations of the I/O driver 200, VNBIAS voltage generator 310, and VPBIAS voltage generator 320 in accordance with another aspect of the disclosure. The x- or horizontal axis of the timing diagram represents time, and is divided into four primary time intervals: (1) when the output voltage VPAD of the I/O driver 200 is substantially at a steady-state high logic voltage VDDPX (3.6V), which is indicated in the left- most and right-most columns of the timing diagram; (2) when the output voltage VPAD is transitioning from the high logic voltage VDDPX (3.6V) to a low logic voltage Vss (0V), which is indicated in the second column from the left; (3) when the output voltage VPAD of the I/O driver 200 is substantially at a steady-state low logic voltage Vss (0V), which is indicated in the third column from the left; and (4) when the output voltage VPAD is transitioning from the low logic voltage Vss (0V) to the high logic voltage VDDPX (3.6V), which is indicated in the fourth column from the left.

[0091] The y- or vertical axis of the timing diagram represents the various voltages of the I/O driver 200, VNBIAS voltage generator 310, and VPBIAS voltage generator 320. For instance, from top to bottom, the voltages are: (1) the output voltage VPAD at the output of the I/O driver 200; (2) the voltage V _PA D_HV at the first input of the NAND gate 312; (3) the voltage VPAD LV at the first input of the NOR gate 322; (4) the control voltage VpcTL Lv at the second input of the NOR gate 322 (generated by the second PMOS predriver 211); (5) the gate bias voltage VPBIAS for PMOS M _P2 2; (6) the control voltage VNCTL HV at the second input of the NAND gate 312 (generated by the second NMOS predriver 221); and (7) the gate bias voltage VNBIAS for NMOS M _N 22-

[0092] In operation, when the output voltage VPAD of the I/O driver 200 is at the steady-state high logic voltage VDDPX (3.6V), PMOS Mp3i is turned on because its source is at VDDPX (3.6V) and its gate is at VDDIX (1.8V); thus, PMOS M _P31 has a V _G s of 1.8V, which is greater than its threshold voltage V _T of 0.4V. Additionally, PMOS M _P32 is turned off because its source is at VDDPX (3.6V) and its gate is at VDDPX (3.6V); thus, PMOS M _P32 has a VGS of 0V, which is less than its threshold voltage VT of 0.4V. Accordingly, the voltage VpAD _j rv at the first input of the NAND gate 312 is at a high logic voltage VDDPX (3.6V). The voltage VNCTL HV is at a l° ^w logic voltage of VDDIX (1.8V). Thus, since the inputs to the NAND gate 312 are high and low logic voltages, the NAND gate 312 generates a high logic voltage, and the inverter 314 outputs V BIAS as a relatively low bias voltage VDDIX (1.8V), as indicated in the timing diagram of FIG. 3B.

[0093] Also, when the output voltage VPAD of the I/O driver 200 is the steady-state high logic voltage VDDPX (3.6V), NMOS M _N 32 is turned on because its gate is at VDDPX (3.6V) and its source is at VDDIX (1.8V); thus, NMOS M _N 32 has a VGS of 1.8V, which is greater than its threshold voltage VT of 0.4V. Thus, since M _N 32 is turned on, the voltage VPAD LV at the first input of the NOR gate 322 is at a high logic voltage VDDIX (1.8V). NMOS M _N 3i is turned off since its gate is at VDDIX (1.8V) and its source is at VDDIX (1.8V); thus, NMOS M _N 32 has a V _G s of 0V, which is less than its threshold voltage V _T of 0.4V. The voltage VPCTL LV is at a low logic voltage of Vss (0V). Thus, since the inputs to the NOR gate 322 are high and low logic voltages, the NOR gate 322 generates a low logic voltage, and the inverter 324 outputs VPBIAS as a relatively high bias voltage VDDIX (1.8V), as indicated in the timing diagram of FIG. 3B.

[0094] When the output voltage VPAD is to be transitioned from the high logic voltage VDDPX (3.6V) to a low logic voltage Vss (0V), the control voltage VNCTL HV is raised to a logic high voltage VDDPX (3.6V) and VPCTL LV is raised to a high logic voltage VDDIX (1.8V). Accordingly, the inputs to the NAND gate 312 are both at high logic voltages; and thus, the NAND gate 312 outputs a low logic voltage and the inverter 314 outputs VNBIAS as a relatively high bias voltage VDDPX (3.6V). As previously discussed, VNBIAS being high configures the NMOS M _N 22 of I/O driver 200 to have similar resistance as the resistance of NMOS M _N 2i SO that the voltages across the devices M _N 2i and M _N 22 are substantially equal to prevent an over-voltage of the devices.

[0095] When the output voltage VPAD has decreased to a defined voltage where VPAD HV is interpreted by the NAND gate 312 as a low logic voltage, the inputs to the NAND gate 312 are at low and high logic voltages; and accordingly, the NAND gate 312 generates a high logic voltage, and the inverter 314 outputs VNBIAS as a relatively low bias voltage VDDIX (1.8V). At such time, the output voltage VPAD has sufficiently decreased to prevent over-voltage of NMOS M _N 22 and M _N 2i of I/O driver 200. PMOS M _P32 turns on when the output voltage V _P AD has decreased to substantially VDDK - T (threshold of M _P32 ) and PMOS M _P3 i turns off when the output voltage VPAD has decreased to VDDK + V _T (threshold of M _P31 ).

[0096] Thus, as indicated in the timing diagram of FIG. 3B, the bias voltage VNBIAS is temporarily raised during an initial portion or discharge subinterval of the transition of the output voltage VPAD from high-to-low to prevent an over-voltage condition of NMOS MN22 and MN ₂ I. The time interval in which VNBIAS is at the raised state depends on when the voltage VPAD HV becomes a low logic voltage as interpreted by the NAND gate 312. The output voltage VPAD decreases at a rate that depends on the capacitive load CLOAD; e.g., small capacitive load CLOAD, faster rate of decrease for VPAD; larger capacitive load CLOAD, slower rate of decrease for VPAD- Thus, the bias voltage VNBIAS is held at the raised state for sufficient amount of time to prevent an over-voltage NMOS M _N 22 due to VDS being above the reliability limit if VNBIAS is otherwise brought to a lower bias voltage too early, and prevent an over-voltage of NMOS M _N 22 due to VGS and/or VGD being above the reliability limit if VNBIAS is otherwise kept at the higher bias voltage for too long.

[0097] As indicated in the timing diagram of FIG. 3B, during the transition of the output voltage VPAD from high-to-low, the bias voltage VPBIAS remains at the relatively high bias voltage VDDIX (1.8V). This is because the control voltage VPCTL LV is raised to a high logic voltage VDDK (1.8V) during the transition of the output voltage VPAD from high-to-low. In response to the high logic voltage VPCTL LV, the NOR gate 322 generates a low logic voltage, and the inverter 324 maintains VPBIAS at the relatively high bias voltage VDDIX (1.8V).

[0098] When the output voltage VPAD is to be transitioned from the low logic voltage Vss (0V) to a high logic voltage VDDPX (3.6V), the control voltage VPCTL LV is lowered to a low logic voltage Vss (0V) and control voltage VNCTL HV is lowered to a low logic voltage VDDIX (1.8V). Accordingly, the inputs to the NOR gate 322 are both at low logic voltages; and thus, the NOR gate 322 outputs a high logic voltage and the inverter 324 outputs VPBIAS as a relatively low bias voltage Vss (0V). As previously discussed, VPBIAS being low configures the PMOS M _P2 2 of I/O driver 200 to have similar resistance as the resistance of PMOS M _P21 so that the voltages across the devices M _P21 and M _P2 2 are substantially equal to prevent an over-voltage of the devices. [0099] When the output voltage V _P AD has increased to a defined voltage where VPAD LV is interpreted by the NOR gate 322 as a high logic voltage, the NOR gate 322 generates a low logic voltage, and the inverter 324 outputs VPBIAS as a relatively high bias voltage VDDIX (1.8V). At such time, the output voltage VPAD has sufficiently increased to prevent over-voltage of PMOS M _P22 and M _P2 i of I/O driver 200. NMOS M _N 3 i turns off when the output voltage VPAD has increased to substantially VDDIX - VT (threshold of MN3I) and NMOS Mp ₃₂ turns on when the output voltage VPAD has increased to VDDIX + V _T (threshold of M _N32 ).

[0100] Thus, as indicated in the timing diagram of FIG. 3B, the bias voltage VPBIAS is temporarily lowered during an initial portion or charge subinterval of the transition of the output voltage VPAD from low-to-high to prevent an over-voltage condition of PMOS M _P22 and M _P21 . The time interval in which VPBIAS is at the lowered state depends on when the voltage VPAD LV becomes a high logic voltage as interpreted by the NOR gate 322. The output voltage VPAD increases at a rate that depends on the capacitive load CLOAD; e.g., small capacitive load CLOAD, faster rate of increase for VPAD; larger capacitive load CLOAD, slower rate of increase for VPAD- Thus, the bias voltage VPBIAS is held at the raised state for sufficient amount of time to prevent an over-voltage PMOS M _P22 due to VDS being above the reliability limit if VPBIAS is otherwise brought to a high bias voltage too early, and prevent an over-voltage of PMOS M _P22 due to VGS and/or VGD being above the reliability limit if VPBIAS is otherwise kept at the low bias voltage for too long.

[0101] As indicated in the timing diagram of FIG. 3B, during the transition of the output voltage VPAD from low-to-high, the bias voltage V BIAS remains at the relatively low bias voltage VDDIX (1.8V). This is because the control voltage VNCTL HV is lowered to a low logic voltage Vss (0V) during the transition of the output voltage VPAD from low-to- high. In response to the logic high voltage VNCTL HV, the NAND gate 312 generates a high logic voltage, and the inverter 314 maintains VNBIAS at the relatively low bias voltage VDDIX (1.8V).

[0102] FIG. 4 illustrates a schematic diagram of an exemplary bias voltage generator 400 including Vpi voltage generator 410 and VNI voltage generator 420. The Vpi and VNI voltage generators 410 and 420 may be one exemplary detailed implementation of the VPI and VNI voltage generators 214 and 224 of I/O driver 200, respectively. As previously discussed, the Vpi voltage generator 410 is configured to generate a defined voltage VPI at VDDIX (1.8V) when the output voltage VPAD is at steady-state low logic voltage Vss (0V). This is to protect PMOS M _P2 2 from an over-voltage condition. Similarly, the VNI voltage generator 420 is configured to generate a defined voltage VNI at VDDK (1.8V) when the output voltage VPAD is at steady-state high logic voltage VDDPX (3.6V). This is to protect NMOS M _N 22 from an over-voltage condition. This applies to both situations: (1) when the I/O driver 200 is driving the output voltage VPAD; and (2) when the I/O driver 200 is presenting high impedance at the output and another device is driving the output voltage VPAD-

[0103] In particular, the VPI voltage generator 410 includes a PMOS M _P41 , a PMOS M _P42 , and an NMOS M _N4 3. The PMOS M _P4 i includes source and drain coupled between the output (VPAD) of the I/O driver 200 and a drain of NMOS M _N43 . The gate of PMOS Mp4i is configured to receive the constant bias voltage VDDIX- The PMOS M _P42 includes source and drain coupled between a source of the constant bias voltage VDDIX and the drain of NMOS M _N4 3. The gate of PMOS M _P42 is coupled to the output (VPAD) of the I/O driver 200. The gate of NMOS M _N4 3 is configured to receive the control voltage VpcTL Hv- The defined voltage V _P1 is generated at the source of M _N4 3.

[0104] The VNI voltage generator 420 includes an NMOS M _N41 , an NMOS M _N42 , and a PMOS Mp ₄₃ . The NMOS M _N4 i includes drain and source coupled between the output (VPAD) of the I/O driver 200 and a drain of PMOS M _P43 . The gate of M _N4 i is configured to receive the constant bias voltage VDDIX- The NMOS M _N42 includes source and drain coupled between the source of the constant bias voltage VDDIX and the drain of PMOS Mp ₄ 3. The gate of NMOS M _N42 is coupled to the output (V _PA D) of the I/O driver 200. The gate of PMOS Mp ₄₃ is configured to receive the control voltage VNCTL LV- The bias voltage VNI is generated at the source of M _P43 .

[0105] The circuit including PMOS M _P4 i and M _P42 and NMOS M _N4 i and M _N4 2 operate as a waveform splitter. That is, as discussed, the voltage domain for the output voltage VPAD has high and low logic voltages at VDD _P X and Vss, respectively. The portion of the waveform splitter having PMOS M _P4 i and M _P42 generates the signal V _P AD_HV that tracks the high and low logic voltages of the output voltage V _P AD but in a different voltage domain having high and low voltages at VDD _P X and VDDIX, respectively. Similarly, the portion of the waveform splitter having NMOS M _N4 i and M _N42 generates the signal VPAD LV that tracks the high and low logic voltages of the output voltage VPAD but in a different voltage domain having high and low voltages at VDDIX and Vss, respectively.

[0106] Considering first the case where the I/O driver 200 is driving the output voltage VPAD to a high logic voltage VDDPX (3.6V). In such case, the control voltages VPCTL HV and VNCTL LV are at low logic voltages VDDIX (1.8V) and Vss (0V), respectively. With regard to V _P i voltage generator 410, PMOS M _P4 i is turned on, PMOS M _P42 is turned off, and NMOS MN43 is effectively turned off. Thus, the defined voltage Vpi is at VDDPX (3.6V) due to the turned on PMOS M _P n and M _P2 2 of the pull-up circuit. With regard to VNI voltage generator 420, NMOS M _N42 is turned on, NMOS M _N4i is turned off, and PMOS Mp43 is turned on. Thus, the defined voltage VNI is at VDDIX (1.8V) via the turned on M _N 42 and M _P43 . The defined voltage VNI (1.8V) at the source of NMOS M _N 22 protects the device from over-voltage when the output voltage VPAD is driven to a high logic voltage VDDPX (3.6V) by the I/O driver 200.

[0107] Considering next the case where the I/O driver 200 is driving the output voltage VPAD to a low logic voltage Vss (0V). In such case, the control voltages VPCTL HV and VNCTL LV are at high logic voltages VDDPX (3.6V) and VDDIX (1.8V), respectively. With regard to VNI voltage generator 420, NMOS M _N 42 is turned off, NMOS M _N 4i is turned on, and PMOS Mp ₄₃ is effectively turned off. Thus, the defined voltage VNI is at 0V (VPAD) via the turned on M _N 2i and M _N 22 of the pull-down circuit. With regard to VPI voltage generator 410, PMOS M _P4 i is turned off, PMOS M _P42 is turned on, and NMOS M _N 43 is turned on. Thus, the voltage VPI is at VDDIX (1.8V) via the turned on M _P42 and M _N 43. The defined voltage Vpi (1.8V) at the source of PMOS Mp22 protects the device from over-voltage when the output voltage VPAD driven to a low logic voltage Vss (0V) by the I/O driver 200.

[0108] Considering next the case where the I/O driver 200 is providing high impedance at the output and another device is driving the output voltage VPAD to a high logic voltage VDDPX (3.6V). In such case, the control voltages VPCTL HV and VNCTL LV are at a high logic voltage VDDPX (3.6V) and a low logic voltage Vss (0V), respectively. With regard to VPI voltage generator 410, PMOS M _P4 i is turned on, PMOS M _P4 2 is turned off, and NMOS M _N 43 is turned on. Thus, the defined voltage VPI is at VDDPX (3.6V) via the turned on M _P4 i and M _N 43. With regard to VNI voltage generator 420, NMOS M _N 42 is turned on, NMOS M _N 4i is turned off, and PMOS M _P43 is turned on. Thus, the defined voltage VN _I is at V _DDIX (1.8V) via the turned on M _N42 and M _{P 3} . The defined voltage V _NI (1.8V) at the source of NMOS M _N22 protects the device from over-voltage when the output voltage V _PAD driven to V _DDPX (3.6V) by another device.

[0109] Considering next the case where the I/O driver 200 is providing a high impedance at the output and another device is driving the output voltage V _PAD to a low logic voltage Vss (0V). In such case, the voltages V _{PCTL HV} and VN _{CTL LV} are at high logic voltage V _DDPX (3.6V) and low logic voltage V _DDIX (1.8V), respectively. With regard to VN _I voltage generator 420, NMOS M _N42 is turned off, NMOS M _N4 i is turned on, and PMOS M _P43 is turned on. Thus, the voltage V _NI is at Vss (0V) via turned on M _N4 i and M _{P 3} . With regard to V _P i voltage generator 410, PMOS M _P4i is turned off, PMOS M _P42 is turned on, and NMOS M _N43 is turned on. Thus, the defined voltage Vpi is at V _DDK (1.8V) via the turned on M _{P 2} and M _N43 . The defined voltage V _PI (1.8V) at the source of PMOS M _P22 protects the device from over-voltage when the output voltage V _PAD driven to a low logic voltage Vss (0V) by another device.

[0110] FIG. 5 A illustrates a schematic diagram of an exemplary predriver 500 in accordance with another aspect of the disclosure. The predriver 500 may be an exemplary detailed implementation of the first PMOS predriver 210 previously discussed.

[0111] In summary, the predriver 500 generates the control signal V _{PCTL HV} based on an input signal V _IN . That is, based on an enable signal EN being asserted, the predriver 500 generates the control signal V _{PCTL HV} at a high logic voltage (V _DDPX ) in a first voltage domain in response to the input signal V _IN being at a low logic voltage in a second voltage domain. Similarly, based on the enable signal EN being asserted, the predriver 500 generates the control signal V _{PCTL HV} at a low logic voltage (V _DDIX ) in the first voltage domain in response to the input signal V _IN being at a high logic voltage in the second voltage domain. Based on the enable signal EN not being asserted, the predriver 500 generates the control signal V _{PCTL HV} at the high logic voltage (V _DDPX ) regardless of the logic state of the input signal V _IN .

[0112] In particular, the predriver 500 includes a level shifter 505 and an inverter 510. The inverter 510, in turn, includes a first transistor (e.g., PMOS) Mp¾i and a second transistor (e.g., NMOS) M _N 5 i coupled in series between a first voltage rail (V _DDPX ) and a second voltage rail (V _DDIX ). The control terminals (e.g., gates) of the PMOS M _P5 i and NMOS M _N 5i are coupled together, and to an output of the level shifter 505. The predriver 500 is configured to generate the control signal VPCTL HV at a node between (e.g., drains of) the PMOS M _P5 i and NMOS M _N51 . The level shifter 505 includes a signal input configured to receive the input signal VIN and a control input configured to receive the enable signal EN. As previously discussed, the level shifter 505 includes a signal output coupled to the gates of PMOS M _P5 i and NMOS M _N 5 i- [0113] In operation, when the enable signal EN is asserted, the level shifter 505 generates an output signal to turn on PMOS Μρ¾ι and turn off NMOS MNSI in response to the input signal VIN being at a low logic voltage. This causes the control signal VPCTL HV to be substantially at the high logic voltage of VDDPX- Also, when the enable signal EN is asserted, the level shifter 505 generates an output signal to turn off PMOS M _P5 i and turn on NMOS M _N 5 i in response to the input signal VIN being at a high logic voltage. This causes the control signal VPCTL HV to be substantially at the low logic voltage of VDDIX- When the enable signal EN is not asserted, the level shifter 505 generates an output signal to turn on PMOS M _P5 i and turn off NMOS M _N 5 i regardless of the logic state of the input signal VIN. This causes the control signal VPCTL HV to be maintained substantially at the high logic voltage of VDDPX when the enable signal EN is not asserted.

[0114] FIG. 5B illustrates a schematic diagram of another exemplary predriver 520 in accordance with another aspect of the disclosure. The predriver 520 may be an exemplary detailed implementation of the second PMOS predriver 211 previously discussed.

[0115] In summary, the predriver 520 generates the control signal VPCTL LV based on an input signal VIN. That is, based on an enable signal EN being asserted, the predriver 520 generates the control signal VPCTL HV at a high logic voltage (VDDTX) in a third voltage domain in response to the input signal VIN being at a low logic voltage in the second voltage domain. Similarly, based on the enable signal EN being asserted, the predriver 520 generates the control signal VPCTL LV at a low logic voltage (Vss) in the third voltage domain in response to the input signal VIN being at a high logic voltage in the second voltage domain. Based on the enable signal EN not being asserted, the predriver 520 generates the control signal VPCTL LV at the high logic voltage (VDDTX) regardless of the logic state of the input signal VIN. [0116] In particular, the predriver 520 includes a level shifter 525 and an inverter 530. The inverter 530, in turn, includes a first transistor (e.g., PMOS) M _P52 and a second transistor (e.g., NMOS) M _N 52 coupled in series between a first voltage rail (VDDIX) and a second voltage rail (Vss). The control terminals (e.g., gates) of the PMOS M _P52 and NMOS M _N 52 are coupled together, and to an output of the level shifter 525. The predriver 520 is configured to generate the control signal VPCTL LV at a node between (e.g., drains of) the PMOS M _P52 and NMOS M _N5 2. The level shifter 525 includes a signal input configured to receive the input signal VIN and a control input configured to receive the enable signal EN. As previously discussed, the level shifter 525 includes a signal output coupled to the gates of PMOS M _P52 and NMOS M _N52 .

[0117] In operation, when the enable signal EN is asserted, the level shifter 525 generates an output signal to turn on PMOS M _P52 and turn off NMOS M _N ¾ ₂ in response to the input signal VIN being at a low logic voltage. This causes the control signal V _P CTL_LV to be substantially at the high logic voltage of VDDIX- Also, when the enable signal EN is asserted, the level shifter 525 generates an output signal to turn off PMOS M _P ¾ ₂ and turn on NMOS M _N 5 ₂ in response to the input signal VIN being at a high logic voltage. This causes the control signal V _P CTL_LV to be substantially at the low logic voltage of Vss- When the enable signal EN is not asserted, the level shifter 525 generates an output signal to turn on PMOS M _P52 and turn off NMOS M _N ¾ ₂ regardless of the logic state of the input signal VIN. This causes the control signal V _P CTL_LV to be maintained substantially at the high logic voltage of VDDIX when the enable signal EN is not asserted.

[0118] FIG. 5C illustrates a schematic diagram of another exemplary predriver 540 in accordance with another aspect of the disclosure. The predriver 540 may be an exemplary detailed implementation of the first NMOS predriver 220 previously discussed.

[0119] In summary, the predriver 540 generates the control signal VNCTL LV based on an input signal VIN. That is, based on an enable signal EN being asserted, the predriver 540 generates the control signal VNCTL LV at a high logic voltage (VDDIX) in the third voltage domain in response to the input signal VIN being at a low logic voltage in the second voltage domain. Similarly, based on the enable signal EN being asserted, the predriver 540 generates the control signal VNCTL LV at a low logic voltage (Vss) in the third voltage domain in response to the input signal VIN being at a high logic voltage in the second voltage domain. Based on the enable signal EN not being asserted, the predriver 540 generates the control signal VNCTL LV at the l° ^w logic voltage (Vss) regardless of the logic state of the input signal VIN.

[0120] In particular, the predriver 540 includes a level shifter 545 and an inverter 550. The inverter 550, in turn, includes a first transistor (e.g., PMOS) M _P53 and a second transistor (e.g., NMOS) MN53 coupled in series between a first voltage rail (VDDIX) and a second voltage rail (Vss)- The control terminals (e.g., gates) of the PMOS M _P53 and NMOS M _N 53 are coupled together, and to an output of the level shifter 545. The predriver 540 is configured to generate the control signal VNCTL LV at a node between (e.g., drains of) the PMOS M _P53 and NMOS M _N53 . The level shifter 545 includes a signal input configured to receive the input signal VIN and a control input configured to receive the enable signal EN. As previously discussed, the level shifter 545 includes a signal output coupled to the gates of PMOS M _P53 and NMOS M _N 53-

[0121] In operation, when the enable signal EN is asserted, the level shifter 545 generates an output signal to turn on PMOS M _P53 and turn off NMOS M _N¾3 in response to the input signal VIN being at a low logic voltage. This causes the control signal VNCTL LV to be substantially at the high logic voltage of VDDIX- Also, when the enable signal EN is asserted, the level shifter 545 generates an output signal to turn off PMOS M _P53 and turn on NMOS M _N 5 ₃ in response to the input signal VIN being at a high logic voltage. This causes the control signal VNCTL LV to be substantially at the low logic voltage of Vss- When the enable signal EN is not asserted, the level shifter 545 generates an output signal to turn off PMOS M _P53 and turn on NMOS M _N¾3 regardless of the logic state of the input signal VIN. This causes the control signal VNCTL LV to be maintained substantially at the low logic voltage of Vss when the enable signal EN is not asserted.

[0122] FIG. 5D illustrates a schematic diagram of an exemplary predriver 560 in accordance with another aspect of the disclosure. The predriver 560 may be an exemplary detailed implementation of the second NMOS predriver 221 previously discussed.

[0123] In summary, the predriver 560 generates the control signal VNCTL HV based on an input signal VIN. That is, based on an enable signal EN being asserted, the predriver 560 generates the control signal VNCTL HV at a high logic voltage (VDDPX) in the first voltage domain in response to the input signal VIN being at a low logic voltage in the second voltage domain. Similarly, based on the enable signal EN being asserted, the predriver 560 generates the control signal VNCTL HV at a low logic voltage (VDDIX) in the first voltage domain in response to the input signal VIN being at a high logic voltage in the second voltage domain. Based on the enable signal EN not being asserted, the predriver 560 generates the control signal VNCTL HV at the low logic voltage (VDDIX) regardless of the logic state of the input signal VIN.

[0124] In particular, the predriver 560 includes a level shifter 565 and an inverter 570. The inverter 570, in turn, includes a first transistor (e.g., PMOS) Mp ₅₄ and a second transistor (e.g., NMOS) M _N 54 coupled in series between a first voltage rail (VDDPX) and a second voltage rail (VDDIX)- The control terminals (e.g., gates) of the PMOS Mp ₅₄ and NMOS M _N 54 are coupled together, and to an output of the level shifter 565. The predriver 560 is configured to generate the control signal VNCTL HV at a node between (e.g., drains of) the PMOS M _P54 and NMOS M _N 54- The level shifter 565 includes a signal input configured to receive the input signal VIN and a control input configured to receive the enable signal EN. As previously discussed, the level shifter 565 includes a signal output coupled to the gates of PMOS M _P54 and NMOS M _N 54-

[0125] In operation, when the enable signal EN is asserted, the level shifter 565 generates an output signal to turn on PMOS M _P54 and turn off NMOS M _N 54 in response to the input signal VIN being at a low logic voltage. This causes the control signal VNCTL HV to be substantially at the high logic voltage of VDDPX- Also, when the enable signal EN is asserted, the level shifter 565 generates an output signal to turn off PMOS M _P54 and turn on NMOS MN54 in response to the input signal VIN being at a high logic voltage. This causes the control signal VNCTL HV to be substantially at the low logic voltage of VDDIX- When the enable signal EN is not asserted, the level shifter 565 generates an output signal to turn off PMOS M _P54 and turn on NMOS M _N ¾ ₄ regardless of the logic state of the input signal VIN- This causes the control signal VNCTL HV to be maintained substantially at the low logic voltage of VDDK when the enable signal EN is not asserted.

[0126] FIG. 6 illustrates a flow diagram of an exemplary method 600 of generating an output voltage based on an input voltage in accordance with another aspect of the disclosure. The method 600 includes coupling a first voltage rail to an output by turning on a first transistor and a second transistor coupled in series between the first voltage rail and the output in response to an input voltage transitioning from a first low logic voltage to a first high logic voltage (block 602). An examples of means for coupling the first voltage rail to the output include the pull-up circuit with PMOS M _P2 i and M _P2 2 coupled in series between the voltage rail (VDDPX) and the output (VPAD) in I/O driver 200 depicted in FIG. 2A.

[0127] The method 600 further includes decoupling a second voltage rail from the output by turning off a third transistor and a fourth transistor coupled in series between the output and the second voltage rail in response to the input voltage transitioning from the first low logic voltage to the first high logic voltage, wherein a voltage at the output transitions from a second low logic voltage towards a second high logic voltage in response to the coupling of the first voltage rail to the output and the decoupling of the second voltage rail from the output (block 604). An example of means for decoupling a second voltage rail from the output include the pull-down circuit with NMOS M _N 22 and M _N 2i coupled in series between the output (VPAD) and the voltage rail (Vss) ^m I/O driver 200 depicted in FIG. 2A.

[0128] Additionally, the method 600 includes coupling the second voltage rail to the output by turning on the third transistor and the fourth transistor in response to the input signal transitioning from the first high logic voltage to the first low logic voltage (block 606). An example of means for coupling the second voltage rail to the output include the pulldown circuit with NMOS M _N 22 and M _N 2i coupled in series between the output (VPAD) and the voltage rail (Vss) in I/O driver 200 depicted in FIG. 2A.

[0129] Further, the method 600 includes decoupling the first voltage rail from the output by turning off the first transistor and the second transistor in response to the input signal transitioning from the first high logic voltage to the low logic voltage, wherein the output voltage transitions from the second high logic voltage towards the second low logic voltage in response to the coupling of the second voltage rail to the output and the decoupling of the first voltage rail from the output (block 608). An examples of means for decoupling the first voltage rail from the output include the pull-up circuit with PMOS Mp2i and Mp22 coupled in series between the voltage rail (VDDPX) and the output (VPAD) in I/O driver 200 depicted in FIG. 2 A.

[0130] The method 600 also includes transitioning a first bias voltage applied to a control input of the second transistor from a first relatively high voltage to a first relatively low voltage approximately when the output voltage begins transitioning from the second low logic voltage towards the second high logic voltage (block 610). Examples of such means for transitioning a first bias voltage include the VPBIAS voltage generators 212 and 320 depicted in FIGs. 2A and 3A, respectively.

[0131] The method 600 further includes transitioning the first bias voltage from the first relatively low voltage to the first relatively high voltage while the output voltage continues to transition from the second low logic voltage towards the second high logic voltage (block 612). Examples of such means for transitioning the first bias voltage include the VPBIAS voltage generators 212 and 320 depicted in FIGs. 2A and 3A, respectively.

[0132] In addition, the method 600 includes transitioning a second bias voltage applied to a control input of the third transistor from a second relatively low voltage to a second relatively high voltage approximately when the output voltage begins transitioning from the second high logic voltage towards the low logic voltage (block 614). Examples of such means for transitioning a second bias voltage include the VNBIAS voltage generators 222 and 310 depicted in FIGs. 2A and 3A, respectively.

[0133] The method 600 also includes transitioning the second bias voltage from the second relatively high voltage to the second relatively low voltage while the output voltage continues to transition from the second high logic voltage towards the second low logic voltage (block 616). Examples of such means for transitioning the second bias voltage include the VNBIAS voltage generators 222 and 310 depicted in FIGs. 2A and 3 A, respectively.

[0134] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.