Title:
DRY FILM AND FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/060138
Kind Code:
A1
Abstract:
Provided is a dry film that satisfies the required performance of an insulating film for a flexible printed wiring board and is suitable for a collective formation process of a bending portion and mounting portion. Further provided is a flexible printed wiring board that has said dry film as a protective film, e.g. a coverlay or solder resist. Provided are: a laminate-structure dry film formed by laminating at least two different types of resin compositions, said dry film having at least one resin composition having a cured product glass transition point of less than 100 °C and at least one resin composition having a cured product glass transition point of 100 °C or more; and a flexible printed wiring board that uses said dry film.
Inventors:
MIYABE HIDEKAZU (JP)
KOIKE NAOYUKI (JP)
UCHIYAMA TSUYOSHI (JP)
KASAMA MICHIKO (JP)
KOIKE NAOYUKI (JP)
UCHIYAMA TSUYOSHI (JP)
KASAMA MICHIKO (JP)
Application Number:
PCT/JP2015/078965
Publication Date:
April 21, 2016
Filing Date:
October 13, 2015
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
G03F7/004; B32B27/34; H05K3/28
Foreign References:
| JP2005221857A | 2005-08-18 | |||
| JP2008015384A | 2008-01-24 |
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
Ichiro Honda (JP)
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