Title:
DRY FILM FOR HOLLOW DEVICE, CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/203102
Kind Code:
A1
Abstract:
A dry film for a hollow device according to the present invention enables good sealing by suppressing the flow of a sealing material into a hollow part of a hollow device. This dry film for a hollow device is provided with a resin layer 3 that comprises a curable resin composition containing a solvent and that is disposed on a carrier film 2. The resin layer 3 is provided with at least one of each of regions 3a and 3b in which the remaining amounts of the solvent contained in the curable resin composition are respectively relatively large and small in the thickness direction. A difference in the remaining amount of the solvent between the region having a relatively large amount thereof and the region having a relatively small amount thereof is not less than 0.2 mass%.
Inventors:
NAKAI KOSHIN (JP)
NAKADA KAZUTAKA (JP)
GUAN ZHONG (JP)
NAKADA KAZUTAKA (JP)
GUAN ZHONG (JP)
Application Number:
PCT/JP2020/010404
Publication Date:
October 08, 2020
Filing Date:
March 10, 2020
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
B32B27/00; H01L23/08
Domestic Patent References:
| WO2013121689A1 | 2013-08-22 |
Foreign References:
| JP2004327623A | 2004-11-18 | |||
| JP2015128148A | 2015-07-09 | |||
| JP2019050253A | 2019-03-28 | |||
| JPH07278274A | 1995-10-24 |
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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