Title:
DRY PLATING APPARATUS AND DRY PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/050377
Kind Code:
A1
Abstract:
The present invention provides a dry plating apparatus which can perform continuous plating by continued smooth supply of solid raw materials. An embodiment provides a dry plating apparatus comprising: a vapor chamber configured such that vapor is sprayed onto a material to be plated within the vapor chamber; an evaporation heating unit disposed outside an evaporation region, in which molten raw materials are placed, within the vapor chamber; a solid raw material supply pipe extending from a solid raw material supply unit to the evaporation region and extending through at least a part of the vapor chamber, so as to supply raw materials to the evaporation region; the solid raw material supply unit connected to the solid raw material supply pipe; and a solid raw material heating unit for heating such solid raw materials that are located outside the evaporation region in the solid raw material supply pipe.
Inventors:
KIM GOO-HWA (KR)
Application Number:
PCT/KR2018/010617
Publication Date:
March 14, 2019
Filing Date:
September 11, 2018
Export Citation:
Assignee:
POSCO (KR)
International Classes:
C23C14/24
Foreign References:
| KR20150071832A | 2015-06-29 | |||
| KR100749024B1 | 2007-08-13 | |||
| KR20110034420A | 2011-04-05 | |||
| KR20100044862A | 2010-04-30 | |||
| JP2016506452A | 2016-03-03 |
Attorney, Agent or Firm:
C&S PATENT AND LAW OFFICE (KR)
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