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Title:
DRY TAPE MATERIAL FOR FIBER PLACEMENT USE, METHOD FOR PRODUCING SAME, AND REINFORCING FIBER LAMINATE AND FIBER-REINFORCED RESIN MOLDED ARTICLE EACH PRODUCED USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/171982
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a reinforcing fiber tape material which has a good ability to be impregnated with a resin when paralleled to form a reinforcing fiber base material, and can achieve high productivity suitable for a fiber placement method, and can be molded into an article having high mechanical strength. For achieving the purpose, a dry tape material for fiber placement use is provided, which is characterized by comprising multiple reinforcing fiber strands meeting the requirements (i) to (iii) mentioned below, wherein the multiple reinforcing fiber strands are restrained by each other and are integrated with each other with a second resin material. (i) In each of the reinforcing fiber strands, each of T1 (μm) and T3 (μm), which respectively represent the thicknesses of a cross section at both ends of each strand as observed in the width direction, falls within the range from 50 to 200% relative to T2 (μm), which is the thickness of the cross section at the center of each strand. (ii) In the reinforcing fiber strands, the number N [unit: K] of filaments and the width W [mm] satisfy the relationship represented by formula: 4.8 < N/W < 12. (iii) The shape of the reinforcing fiber strands is maintained by a hot-melt first resin material having a glass transition temperature Tg or a melting point Tm of 40 to 200°C inclusive.

Inventors:
MIURA, Shingo (Toray Industries Inc., 9-1, Oe-cho, Minato-ku, Nagoya-sh, Aichi 02, 〒4558502, JP)
SATO, Masayuki (Toray Industries Inc., 9-1, Oe-cho, Minato-ku, Nagoya-sh, Aichi 02, 〒4558502, JP)
Application Number:
JP2019/006728
Publication Date:
September 12, 2019
Filing Date:
February 22, 2019
Export Citation:
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Assignee:
TORAY INDUSTRIES, INC. (1-1 Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo, 66, 〒1038666, JP)
International Classes:
C08J5/04; B32B5/26
Domestic Patent References:
WO2017083631A12017-05-18
Foreign References:
JP2018501121A2018-01-18
JP2017521291A2017-08-03
JP2012510385A2012-05-10
JP2016179547A2016-10-13
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