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Title:
DRY-UP METHOD, COOL-DOWN METHOD, AND HEAT-UP METHOD FOR PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/228995
Kind Code:
A1
Abstract:
This dry-up method introduces a purge gas into a suction container (2A) of a pump device (100A), causes the purge gas to pass through a flow path switching device (5A) within the suction container (2A) while causing the purge gas to bypass a submerged pump (1A) within the suction container (2A), introduces, into a suction container (2B) of a pump device (100B), the purge gas that has been passed through the flow path switching device (5A), and causes the purge gas to pass through a flow path switching device (5B) within the suction container (2B) while causing the purge gas to bypass a submerged pump (1B) within the suction container (2B).

Inventors:
HONDA SHUICHIRO (JP)
KASATANI TETSUJI (JP)
IKEDA HAYATO (JP)
WATAJI KEI (JP)
KIKUCHI HYUGA (JP)
IWAMI MITSUTAKA (JP)
SUZUKI ASAKI (JP)
Application Number:
PCT/JP2023/019444
Publication Date:
November 30, 2023
Filing Date:
May 25, 2023
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
F04D13/08; F04D7/02; F04D13/14; F17C13/00
Domestic Patent References:
WO2022113450A12022-06-02
Foreign References:
JPH06307376A1994-11-01
JP2007024166A2007-02-01
JPH05133385A1993-05-28
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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