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Patent Searching and Data


Title:
DUAL-SURFACE POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/012097
Kind Code:
A1
Abstract:
An inner periphery-side cutoff part (X1), in which the polishing surface of an upper plate (12) inclines upwards towards the inner periphery part of the upper plate (12), and an inner periphery-side cutoff part (Y1), in which the polishing surface of a lower plate inclines downwards towards the inner periphery part of the lower plate, are formed on the inner periphery part of the upper plate (12) and of the lower plate (13), respectively; and/or an outer periphery-side cutoff part (X2), in which the polishing surface of the upper plate (12) inclines upwards towards the outer periphery part of the upper plate (12), and an outer periphery-side cutoff part (Y2), in which the polishing surface of the lower plate inclines downwards towards the outer periphery part of the lower plate, are formed on the outer periphery part of the upper plate (12) and of the lower plate (13), respectively.

Inventors:
ESAKI, Keisuke (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
Application Number:
JP2017/017855
Publication Date:
January 18, 2018
Filing Date:
May 11, 2017
Export Citation:
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Assignee:
SUMCO CORPORATION (2-1 Shibaura 1-chome, Minato-ku Tokyo, 34, 〒1058634, JP)
International Classes:
B24B37/12; B24B37/08; H01L21/304
Attorney, Agent or Firm:
SUDA, Masayoshi (6th Floor, Kaneko-en Bldg. 2-13-2, Ikebukuro, Toshima-k, Tokyo 14, 〒1710014, JP)
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