Title:
DUAL-TYPE SOLDER BALL PLACEMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/246567
Kind Code:
A1
Abstract:
The present invention relates to a dual-type solder ball placement system and, more specifically, links two types of ball mounting lines to one solder ball placement system so that solder balls can be mounted in various manners. Specifically, the present invention can simultaneously mount the same solder balls or two types of solder balls having different purposes on two lines in one device, so that the solder balls arranged for various purposes in various patterns can be efficiently mounted. Particularly, the present invention can simultaneously mount, in an in-line system, the solder ball acting as a terminal and a core ball acting as a support, and can prevent the bending of a substrate, a unit, or a chipset according to the trend of being light, thin, short and small. Therefore, reliability and competitiveness can be improved in the semiconductor field, the semiconductor package manufacturing field, the PCB manufacturing field, particularly, the wafer level chip scale package (WLCSP)-based manufacturing field, the solder ball placement system field, and other fields that are similar or related thereto.
Inventors:
LEE KYOUHO (KR)
Application Number:
PCT/KR2020/008567
Publication Date:
December 09, 2021
Filing Date:
July 01, 2020
Export Citation:
Assignee:
SSP INC (KR)
International Classes:
B23K1/00; B23K1/20; B23K3/06; H01L23/00
Domestic Patent References:
| WO2018111263A1 | 2018-06-21 |
Foreign References:
| KR20100054974A | 2010-05-26 | |||
| JP2001223234A | 2001-08-17 | |||
| JP2000077447A | 2000-03-14 | |||
| US20120031954A1 | 2012-02-09 | |||
| KR102123485B1 | 2020-06-16 | |||
| KR102168405B1 | 2020-10-21 |
Attorney, Agent or Firm:
JUNG, Doo Seung (KR)
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