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Title:
DUST CAP AND CONNECTOR ENGAGEMENT ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2014/098150
Kind Code:
A1
Abstract:
A connector engagement assembly (1) comprises: a housing (3) from which a lead frame (9) of an electronic component (7) projects; and a heat-resistant dust cap (5) resistant to the heat generated when soldering the lead frame (9), and disposed in the housing (3) to prevent foreign substances from entering the inside of the housing (3). When the dust cap (5) is set in the housing (3), the center of gravity of the housing (3) and the electronic component (7) is located closer to the lead frame (9) than to a support (11) for the housing (3).

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Inventors:
HIKOSAKA TOMOHIRO (JP)
Application Number:
PCT/JP2013/083947
Publication Date:
June 26, 2014
Filing Date:
December 18, 2013
Export Citation:
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Assignee:
YAZAKI CORP (JP)
International Classes:
G02B6/42; H01R13/52
Domestic Patent References:
WO2012002385A12012-01-05
WO2012002386A12012-01-05
WO2011013289A12011-02-03
Foreign References:
JPH11307817A1999-11-05
JP2012230319A2012-11-22
JP2012238413A2012-12-06
JPH07297418A1995-11-10
JPH0463495A1992-02-28
JPH0463496A1992-02-28
JP2002023009A2002-01-23
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
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