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Title:
DUST CORE, METHOD FOR PRODUCING SAID DUST CORE, ELECTRICAL/ELECTRONIC COMPONENT PROVIDED WITH SAID DUST CORE, AND ELECTRICAL/ELECTRONIC DEVICE EQUIPPED WITH SAID ELECTRICAL/ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/044698
Kind Code:
A1
Abstract:
This dust core 1, which is provided with a molded body 1B containing a soft magnetic powder MM and an exterior coat of the molded body 1B, and wherein the exterior coat contains at least one of a thermoplastic polyimide and a thermoplastic polyamide-imide, has excellent mechanical characteristics and is not susceptible to changes in the magnetic characteristics even if used in a high temperature environment. The exterior coat may have an impregnation structure. The present invention also provides: a method for producing this dust core; an electrical/electronic component which is provided with this dust core; and an electrical/electronic device which is equipped with this electrical/electronic component.

Inventors:
MARUYAMA, Satoshi (1-7, Yukigaya-otsukamachi, Ota-k, Tokyo 01, 〒1458501, JP)
MATSUI, Masao (1-7, Yukigaya-otsukamachi, Ota-k, Tokyo 01, 〒1458501, JP)
Application Number:
JP2018/031351
Publication Date:
March 07, 2019
Filing Date:
August 24, 2018
Export Citation:
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Assignee:
ALPS ALPINE CO., LTD. (1-7 Yukigaya-otsukamachi, Ota-ku Tokyo, 01, 〒1458501, JP)
International Classes:
H01F27/255; H01F1/153; H01F3/08; H01F41/02
Domestic Patent References:
WO2016117201A12016-07-28
WO2010095496A12010-08-26
Foreign References:
JP3145832U2008-10-23
JP2017041507A2017-02-23
JP2009290128A2009-12-10
Other References:
MIHARA, TAKASHI ET AL.: "Thermal and Mechanical Properties of Epoxy Curable Solvent Soluble Imide Resins/Clay Nanocomposites", JOURNAL OF NETWORK POLYMER, JAPAN, vol. 32, no. 6, 2011, pages 332 - 338, XP055580956
Attorney, Agent or Firm:
OKUBO, Katsuyuki (7th Floor, SEIBUNDO Building 4-3-26, Kudan-kita, Chiyoda-k, Tokyo 73, 〒1020073, JP)
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