Title:
DUST-FREE PACKAGING BAG WITH EXCELLENT AUTOMATIC PACKAGING PROPERTIES
Document Type and Number:
WIPO Patent Application WO/2013/136985
Kind Code:
A1
Abstract:
The present invention improves the automatic packaging properties of a dust-free packaging bag in packaging using an automatic packaging machine, said dust-free packaging bag being for use in packaging, for example, an electronic material or component which necessitates high cleanliness. A dust-free packaging bag which is for use in packaging an electronic component or the like and which has at least a sealant layer (2) as the innermost layer, wherein: a polyester film having a gloss value of 40 to 130% is used as an outermost-layer film (4); a primer or adhesive layer that contains an antistatic agent is formed either within a substrate layer (3) or on the innermost side thereof; and the absolute value of the peak initial electrostatic potential at the surface of the outermost-layer film (4) is 2.0kV or less as determined by a friction-charged electrostatic potential test.
Inventors:
KAWAKITA KEITARO (JP)
KARATSU MAKOTO (JP)
KARATSU MAKOTO (JP)
Application Number:
PCT/JP2013/055145
Publication Date:
September 19, 2013
Filing Date:
February 27, 2013
Export Citation:
Assignee:
SHOWA DENKO PACKAGING CO LTD (JP)
International Classes:
B65D30/02; B32B27/36
Foreign References:
| JP2009040439A | 2009-02-26 | |||
| JP2003026838A | 2003-01-29 | |||
| JP2004230894A | 2004-08-19 |
Attorney, Agent or Firm:
SHIMIZU Yoshihito et al. (JP)
Yoshihito Shimizu (JP)
Yoshihito Shimizu (JP)
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