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Title:
DYNAMIC POLYMER OR COMPOSITION HAVING HYBRID BONDING STRUCTURE AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/137505
Kind Code:
A1
Abstract:
A dynamic polymer or composition having a hybrid bonding structure, the same comprising a dynamic inorganic ester bond of silicon borate, and an optional inorganic boron-oxygen-boron bond and a supramolecular hydrogen bond. The dynamic polymer orthogonally combines the dynamic inorganic ester bond of silicon borate and the optional inorganic boron-oxygen-boron bond with the supramolecular hydrogen bond, fully using and developing the different dynamic reversibilities of the two and obtaining excellent stimuli responsiveness, self-reparation and like functional properties, especially good energy absorption effeciency. The dynamic polymer may be widely used for making damping cushioning materials, impact protection materials, self-repairing materials, ductile materials, and the like.

Inventors:
GUO QIONGYU (CN)
XU HUI (CN)
ZHANG HUAN (CN)
LIANG SU (CN)
LIN GAN (CN)
OUYANG YONG (CN)
WENG WENGUI (CN)
Application Number:
CN2018/072455
Publication Date:
August 02, 2018
Filing Date:
January 12, 2018
Export Citation:
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Assignee:
WENG QIUMEI (CN)
International Classes:
C08G77/398; C08G77/38; C08G77/388; C08G77/392; C08G79/08; C08J9/32; C08K5/55; C08K13/02; C08L83/08; C08L101/00
Domestic Patent References:
WO2013127989A12013-09-06
Foreign References:
CN105646872A2016-06-08
CN101343421A2009-01-14
CN105111470A2015-12-02
US5258437A1993-11-02
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