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Patent Searching and Data


Title:
DYNAMIC QUANTITY MEASURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/056673
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a strain sensor module structure having exceptional strain measurement accuracy and suppressing sensor output variation caused by moisture absorbed by a plastic member used as an electrical wiring member, etc., in a strain sensor module. The dynamic quantity measuring apparatus is characterized in having a strain sensor formed by a plurality of piezoelectric resistance elements and electrode pads on the surface of a semiconductor substrate, an electrical wiring plastic member provided with a plurality of wires that electrically connect to the plurality of electrode pads, a strain body joined to the rear surface of the strain sensor, and a bonding part via which the electrical wiring plastic member and strain body are affixed together; a groove being provided in an area of the electrical wiring plastic body that is near the strain sensor.

Inventors:
ASHIDA KISHO (JP)
SOMA ATSUO (JP)
Application Number:
PCT/JP2016/072253
Publication Date:
April 06, 2017
Filing Date:
July 29, 2016
Export Citation:
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Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
G01L1/18; G01B7/06; G01L9/00
Foreign References:
JP4566227B22010-10-20
Other References:
See also references of EP 3358326A4
Attorney, Agent or Firm:
TODA Yuji (JP)
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