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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2011/162239
Kind Code:
Disclosed is a dynamic quantity sensor wherein stress received by the sensor is reduced using a resin package, and fluctuation of sensor characteristics due to the stress is suppressed. The dynamic quantity sensor is provided with: a semiconductor substrate, which has a fixed section, a flexible section positioned inside of the fixed section, and a movable section; and a cap member which covers the flexible section and the movable section. The fixed section has: an inner frame, which surrounds the flexible section and the movable section, and an outer frame positioned on the circumference of the inner frame; a slit which separates the inner frame and the outer frame one from the other; and a connecting section which connects together the inner frame and the outer frame.

HASHIMOTO Katsumi (1-1-1, Ichigaya Kagacho, Shinjuku-k, Tokyo 01, 〒1628001, JP)
Application Number:
Publication Date:
December 29, 2011
Filing Date:
June 21, 2011
Export Citation:
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DAI NIPPON PRINTING Co., Ltd. (1-1-1, Ichigaya Kagacho Shinjuku-k, Tokyo 01, 〒1628001, JP)
大日本印刷株式会社 (〒01 東京都新宿区市谷加賀町一丁目一番一号 Tokyo, 〒1628001, JP)
International Classes:
G01P15/08; B81B3/00; G01P15/12; G01P15/18; H01L29/84
Attorney, Agent or Firm:
Takahashi, Hayashi and Partner Patent Attorneys, Inc. (Sonpo Japan Kamata Building 9F, 5-24-2 Kamata Ota-k, Tokyo 52, 〒1440052, JP)
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