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Title:
EA MATERIAL, AND MANUFACTURING METHOD AND MOUNTING STRUCTURE FOR THE SAME
Document Type and Number:
WIPO Patent Application WO/2005/001307
Kind Code:
A1
Abstract:
An EA material installable on a specified member to be installed even if rods or mounting holes are not formed thereto, a method of manufacturing the EA material, and a mounting structure for the EA material. The EA material (1) comprises a plate-like EA material body (2) and a form tape (3) installed on one principal plate surface of the EA material body (2). An adhesive agent layer (3a) is installed on the form tape (3) and the EA material (1) is adhered to the inner surface of a car body (2) through the adhesive agent layer (3a). By using a mold formed of a drag mold (10) and a cope mold (11), the EA material (1) is manufactured by holding the form tape (3) on the cavity surface of the cope mold (11) and feeding a synthetic resin material into a cavity. A recessed part (12) receiving the form tape (3) is formed in the cope mold (11) holding the form tape (3). In addition, a plurality of claw-like projections (13) are formed at the edge part of the recessed part (12).

Inventors:
Horimatsu, Toshiyuki c/o Yokohama, Plant (Bridgestone Corporation 1, Kashio-cho, Totsuka-k, Yokohama-shi Kanagawa 12, 24408, JP)
Application Number:
PCT/JP2004/007474
Publication Date:
January 06, 2005
Filing Date:
May 31, 2004
Export Citation:
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Assignee:
BRIDGESTONE CORPORATION (10-1, Kyobashi 1-chome Chuo-ku, Tokyo 40, 10483, JP)
Horimatsu, Toshiyuki c/o Yokohama, Plant (Bridgestone Corporation 1, Kashio-cho, Totsuka-k, Yokohama-shi Kanagawa 12, 24408, JP)
International Classes:
B60R21/02; B60R21/04; F16B5/06; F16B5/07; F16B11/00; F16F1/44; F16F7/00; (IPC1-7): F16F7/00; B60J5/00; B60R21/04
Foreign References:
JP2000085487A
JP2002369986A
JPH0691662A
JP2004132463A
Attorney, Agent or Firm:
Shigeno, Tsuyoshi (Nissin bldg, 9F 5-10, Shinjuku 2-chom, Shinjuku-ku Tokyo 22, 16000, JP)
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