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Patent Searching and Data


Title:
EAR PAD, HEADPHONE, EAR CHIP AND FIXING MEMBER
Document Type and Number:
WIPO Patent Application WO/2022/149254
Kind Code:
A1
Abstract:
[Problem] To provide a member for sound reproduction devices which is a simpler method than before, and with which wearability is improved. [Solution] An ear pad according to the present disclosure is a substantially annular ear pad that is attached to a headphone. The ear pad is characterized by having a first portion which is a radially inside portion, a second portion which is a radially outside portion and is a portion on the outside in the thickness direction, and a third portion which is a radially outside portion and is a portion on the outside in the thickness direction, at least the first portion having a lattice structure.

Inventors:
YAMAMOTO KENTARO (JP)
CHISHIMA JUNICHI (JP)
TERAUCHI NATSUKI (JP)
Application Number:
PCT/JP2021/000451
Publication Date:
July 14, 2022
Filing Date:
January 08, 2021
Export Citation:
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Assignee:
NAIN INC (JP)
International Classes:
H04R1/10
Foreign References:
JP2005501580A2005-01-20
JP2017112446A2017-06-22
Attorney, Agent or Firm:
TAKANASHI Reiko (JP)
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