Title:
EARPHONE
Document Type and Number:
WIPO Patent Application WO/2022/213346
Kind Code:
A1
Abstract:
An earphone is provided. The earphone comprises a housing defining an audio opening, the audio opening is configured to be positioned within or facing toward an ear canal of a wearer in an wearing position of the earphone; a speaker driver positioned within the housing, the speaker driver comprising a diaphragm facing toward the audio opening, defining an audio channel between the diaphragm and the opening; a body temperature measuring module positioned within the audio channel, the body temperature measuring module comprising a reflector and a temperature sensor, the temperature sensor is configured to receive an infrared light transmitted through the audio opening and reflected by the reflector.
Inventors:
LI ENDONG (CN)
LIANG TIEYI (CN)
ZOU JINHUA (CN)
LIANG TIEYI (CN)
ZOU JINHUA (CN)
Application Number:
PCT/CN2021/086101
Publication Date:
October 13, 2022
Filing Date:
April 09, 2021
Export Citation:
Assignee:
HARMAN INT IND (US)
LI ENDONG (CN)
LI ENDONG (CN)
International Classes:
H04R1/10; G01J5/00
Foreign References:
| US20170258329A1 | 2017-09-14 | |||
| US20150092952A1 | 2015-04-02 | |||
| CN106551682A | 2017-04-05 | |||
| JP2001057696A | 2001-02-27 |
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
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