Title:
EASILY REMOVABLE ADHESIVE FILM AND METAL PLATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/146617
Kind Code:
A1
Abstract:
The present invention is an easily removable adhesive film, the adhesive strength of which is reduced by exposure to ionizing radiation, and in which an under-layer and a easily removable adhesive layer are laminated, in this order, on a transparent resin film. The under-layer includes an amine curing agent and a carboxyl group-containing resin with an acid number of 10 to 100 mg KOH/g. The easily removable adhesive layer includes a ionizing radiation curable adhesive. By including int the under-layer an amine curing agent and a carboxyl group-containing resin with specific acid number, it is possible to provide an easily removable adhesive film with sustained adhesiveness between the substrate and the under-layer as well as between the under-layer and the easily removable adhesive layer, and excellent resistance to solvents.
Inventors:
ABE NOBUYUKI (JP)
MARUYAMA MITSUNORI (JP)
MARUYAMA MITSUNORI (JP)
Application Number:
PCT/JP2013/058432
Publication Date:
October 03, 2013
Filing Date:
March 22, 2013
Export Citation:
Assignee:
KIMOTO KK (JP)
International Classes:
C09J7/50; C09J11/06; C09J201/00
Foreign References:
| JP2002203816A | 2002-07-19 | |||
| JP2009263657A | 2009-11-12 | |||
| JP2011208180A | 2011-10-20 | |||
| JPH05195255A | 1993-08-03 |
Attorney, Agent or Firm:
Sannozaka Patent Law Firm (JP)
Patent business corporation The Sanno hill patent firm (JP)
Patent business corporation The Sanno hill patent firm (JP)
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