Title:
EBG STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2014/192784
Kind Code:
A1
Abstract:
This EBG structure is provided with: a ground substrate; a first dielectric layer laminated upon said ground substrate; a first conductor pattern laminated upon said first dielectric layer, and having an outer edge and an inner edge, said outer edge being electrically connected to the ground substrate; a second dielectric layer laminated upon said first conductor pattern; and a second conductor pattern laminated upon said second dielectric layer, and having a center section and an outer edge, said center section being electrically connected to the inner edge of the first conductor pattern.
More Like This:
| WO/2013/144296 | LOW RADIATION DOSE RATE MOBILE PHONE |
| WO/2011/004541 | ANTENNA APPARATUS AND WIRELESS COMMUNICATION APPARATUS |
| JP2004007243 | MOBILE RADIO COMMUNICATION APPARATUS |
Inventors:
UEDA TETSUYA (JP)
HATANAKA TAKEZO (JP)
HATANAKA TAKEZO (JP)
Application Number:
PCT/JP2014/064060
Publication Date:
December 04, 2014
Filing Date:
May 28, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01Q1/52; H01Q15/14; H05K1/02
Domestic Patent References:
| WO2011111297A1 | 2011-09-15 | |||
| WO2011114622A1 | 2011-09-22 | |||
| WO2010013496A1 | 2010-02-04 |
Foreign References:
| JP2009004791A | 2009-01-08 | |||
| JP2004505583A | 2004-02-19 | |||
| US20100252319A1 | 2010-10-07 | |||
| JP2002510886A | 2002-04-09 | |||
| JP2008147763A | 2008-06-26 |
Attorney, Agent or Firm:
FUJIMOTO, NOBORU (JP)
Noboru Fujimoto (JP)
Noboru Fujimoto (JP)
Download PDF: