Title:
EBULLIENT COOLING DEVICE, AND ELECTRONIC DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/056288
Kind Code:
A1
Abstract:
Conventionally, when a heat-siphon-type ebullient cooling device is mounted at a high density on a circuit board of an electronic device such as a 1U server or a 2U server, it is not possible to cause condensed coolant to reflux in a stable manner from a heat dissipation unit (condensing unit) to heat-receiving units (boiling units) of the heat siphon, preventing the boiling and condensation heat transfer in the heat siphon from being maintained in a stable manner and making it difficult to obtain a high cooling performance. This ebullient cooling device is characterized in that: the ebullient cooling device is provided with two heat-receiving units (boiling units) for receiving heat from a heat-generating element such as a central processing unit (CPU) mounted on a circuit board provided in an electronic device such as a server and thereby causing a coolant filling the interior of the device to boil and generate vapor, a heat dissipation unit (condensing unit) for cooling and condensing the coolant vapor generated in the heat-receiving units, and single tubes linking the two heat-receiving units and the heat dissipation unit to each other; the single tube that links the heat dissipation unit with the heat-receiving unit, from among the two heat-receiving units, that is disposed further from the heat dissipation unit penetrates the inside of the tube that links the heat dissipation unit with the heat-receiving unit, from among the two heat-receiving units, that is disposed nearer the heat dissipation unit, whereby the tube that links the heat dissipation unit with the heat-receiving unit, from among the two heat-receiving units, that is disposed nearer the heat dissipation unit has a double-tube structure in which an outer tube and an inner tube having different outer diameters are concentrically combined; and a condensing space for causing the coolant vapor to condense in the heat dissipation unit is provided to each of the inner tube and the outer tube of the double tube.
Inventors:
FUJIMOTO TAKAYUKI (JP)
KONDO YOSHIHIRO (JP)
TAKEDA FUMIO (JP)
KATO TAKESHI (JP)
KONDO YOSHIHIRO (JP)
TAKEDA FUMIO (JP)
KATO TAKESHI (JP)
Application Number:
PCT/JP2013/077876
Publication Date:
April 23, 2015
Filing Date:
October 15, 2013
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
F28D15/02; G12B15/02; H01L23/427; H05K7/20
Foreign References:
| JP2012229909A | 2012-11-22 | |||
| JP2012141082A | 2012-07-26 | |||
| JP2011238969A | 2011-11-24 | |||
| JP2001141296A | 2001-05-25 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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