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Title:
EBULLIENT COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/246248
Kind Code:
A1
Abstract:
The ebullient cooling device is provided with an evaporator (10), a condenser (20), a heat medium passage (30), a flow rate adjusting unit (6, 52), and a control unit (5). The evaporator cools an on-board instrument (2) by boiling and evaporating a heat medium through heat exchange between the on-board instrument and the heat medium. The condenser releases heat from the heat medium to an external fluid by condensing the heat medium through heat exchange between the heat medium and the external fluid. The heat medium passage connects the evaporator and the condenser in a loop and circulates the heat medium between the evaporator and the condenser. The flow rate adjusting unit adjusts an evaporator inflow rate, which is the flow rate of liquid-phase heat medium flowing into the evaporator. The control unit controls the operation of the flow rate adjusting unit. The evaporator has a plurality of tubes (101) through which the heat medium flows. At least one of the plurality of tubes comprises a liquid level detection unit (4) that detects the liquid level of the heat medium in the tube. The control unit causes the flow rate adjusting unit to increase the evaporator inflow rate when the liquid level is below a reference level.

Inventors:
MATSUMOTO TAKAFUMI (JP)
OOMI YASUMITSU (JP)
YOSHINORI TAKESHI (JP)
Application Number:
PCT/JP2020/020047
Publication Date:
December 10, 2020
Filing Date:
May 21, 2020
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
B60K11/04; F28D15/02; F28D15/06; H01L23/427; H01M10/44; H01M10/48; H01M10/613; H01M10/625; H01M10/633; H01M10/647; H01M10/6555; H01M10/6557; H01M10/6569; H01M10/663; H05K7/20
Domestic Patent References:
WO2019097913A12019-05-23
WO2019087195A12019-05-09
WO2019092978A12019-05-16
Foreign References:
JP2001349681A2001-12-21
JP2015175534A2015-10-05
GB2295264A1996-05-22
JP2006029672A2006-02-02
JP2012241976A2012-12-10
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
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