Title:
EDDY CURRENT MOLD LEVEL SENSOR
Document Type and Number:
WIPO Patent Application WO/2013/114915
Kind Code:
A1
Abstract:
The eddy current mold level sensor is provided with an oscillator (3) that sends an alternating current signal of a prescribed frequency, a feedback amplifier (4) to which the alternating current signal is supplied, and a detection head (5) having a primary coil (7) and a pair of secondary coils (8,9) that are mutually differentially connected. The output of the feedback amplifier (4) is supplied to the primary coil (7), the output of the secondary coils (8,9) is fed back to the feedback amplifier (4), and the molten steel surface level inside the mold is measured on the basis of the output of the feedback amplifier (4), which changes according to changes in the molten steel surface level. A magnetic shield (12) is provided on the upper end face or on the upper end face and side faces of the detection head (5).
Inventors:
NAKADA MASAYUKI (JP)
ARAI MANABU (JP)
ARAI MANABU (JP)
Application Number:
PCT/JP2013/050112
Publication Date:
August 08, 2013
Filing Date:
January 08, 2013
Export Citation:
Assignee:
SHINAGAWA REFRACTORIES CO (JP)
International Classes:
B22D11/16; B22D11/18; G01B7/00
Foreign References:
| JPH09304163A | 1997-11-28 | |||
| JPS6093316A | 1985-05-25 | |||
| JPS63111248U | 1988-07-16 | |||
| JPH1094862A | 1998-04-14 | |||
| JPH05285122A | 1993-11-02 | |||
| JPH0433451U | 1992-03-18 |
Attorney, Agent or Firm:
TAKAYAMA HIROSHI (JP)
Hiroshi Takayama (JP)
Hiroshi Takayama (JP)
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Claims: