Title:
EDDY CURRENT MONITORING OF METAL RESIDUE OR METAL PILLARS
Document Type and Number:
WIPO Patent Application WO/2012/148862
Kind Code:
A3
Abstract:
A method of chemical mechanical polishing a substrate includes polishing a metal layer on the substrate at a polishing station, monitoring thickness of the metal layer during polishing at the polishing station with an eddy current monitoring system, and halting polishing when the eddy current monitoring system indicates that residue of the metal layer is removed from an underlying layer and a top surface of the underlying layer is exposed.
Inventors:
IRAVANI HASSAN G (US)
XU KUN (US)
SWEDEK BOGUSLAW A (US)
CARLSSON INGEMAR (US)
SHEN SHIH-HAUR (US)
TU WEN-CHIANG (US)
GAGE DAVID MAXWELL (US)
WANG JAMES C (US)
XU KUN (US)
SWEDEK BOGUSLAW A (US)
CARLSSON INGEMAR (US)
SHEN SHIH-HAUR (US)
TU WEN-CHIANG (US)
GAGE DAVID MAXWELL (US)
WANG JAMES C (US)
Application Number:
PCT/US2012/034712
Publication Date:
December 27, 2012
Filing Date:
April 23, 2012
Export Citation:
Assignee:
APPLIED MATERIALS INC (US)
IRAVANI HASSAN G (US)
XU KUN (US)
SWEDEK BOGUSLAW A (US)
CARLSSON INGEMAR (US)
SHEN SHIH-HAUR (US)
TU WEN-CHIANG (US)
GAGE DAVID MAXWELL (US)
WANG JAMES C (US)
IRAVANI HASSAN G (US)
XU KUN (US)
SWEDEK BOGUSLAW A (US)
CARLSSON INGEMAR (US)
SHEN SHIH-HAUR (US)
TU WEN-CHIANG (US)
GAGE DAVID MAXWELL (US)
WANG JAMES C (US)
International Classes:
H01L21/304; H01L21/66
Foreign References:
| US20020055192A1 | 2002-05-09 | |||
| US5343146A | 1994-08-30 | |||
| US20060021974A1 | 2006-02-02 | |||
| US7264537B1 | 2007-09-04 |
Attorney, Agent or Firm:
GOREN, David J. (P. O. Box 1022Minneapolis, Minnesota, US)
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