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Title:
EDGE CHAMFERING BY MECHANICALLY PROCESSING LASER CUT GLASS
Document Type and Number:
WIPO Patent Application WO/2015/113026
Kind Code:
A3
Abstract:
Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser that is followed by mechanical polishing with a compliant polishing wheel.

Inventors:
BANKAITIS JONAS (US)
UHLIG KEVIN WILLIAM (US)
Application Number:
PCT/US2015/013026
Publication Date:
October 01, 2015
Filing Date:
January 27, 2015
Export Citation:
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Assignee:
CORNING INC (US)
International Classes:
C03B33/02; B23K26/00; B23K26/02; B23K26/06; B23K26/36; B23K26/40; B24B9/10; B24D9/02; C03B25/087; C03B29/10; C03B33/07; C03B33/09
Domestic Patent References:
WO2014012125A12014-01-23
Foreign References:
US20130126573A12013-05-23
US20130149494A12013-06-13
US20100147813A12010-06-17
US20130288010A12013-10-31
US20120302139A12012-11-29
US20120196071A12012-08-02
US20100279067A12010-11-04
Attorney, Agent or Firm:
SHORT, Svetlana Z. (Intellectual Property DepartmentSP-Ti-03-0, Corning New York, US)
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