Title:
ELASTIC BOUNDARY WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/007462
Kind Code:
A1
Abstract:
An elastic boundary wave device (1) reduced in size, enabling the advancement
of a reduction in height, and manufacturable at low cost. A first IDT electrode
(3) is formed on the first surface (2a) of a substrate (2), and a first dielectric
film (5) is formed so as to cover the first IDT electrode (3). A second IDT electrode
(4) is formed on the second surface (2b) of the substrate, and a second dielectric
film (6) is formed so as to cover the second IDT electrode (4). Either of the substrate
and the first and second dielectric films (5) and (6) comprises piezoelectricity.
Inventors:
KANDO HAJIME (JP)
Application Number:
PCT/JP2006/309328
Publication Date:
January 18, 2007
Filing Date:
May 09, 2006
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
KANDO HAJIME (JP)
KANDO HAJIME (JP)
International Classes:
H03H9/145; H01L41/09; H01L41/18; H01L41/22; H03H3/08
Domestic Patent References:
WO2004095699A1 | 2004-11-04 | |||
WO2004070946A1 | 2004-08-19 | |||
WO2005069486A1 | 2005-07-28 |
Foreign References:
JP2000224000A | 2000-08-11 | |||
JP2003017980A | 2003-01-17 | |||
JPH08265089A | 1996-10-11 | |||
JPH0637582A | 1994-02-10 | |||
JP2000049559A | 2000-02-18 |
Attorney, Agent or Firm:
MIYAZAKI, Chikara (Tanimachi 1-chome Chuo-k, Osaka-shi Osaka 12, JP)
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