Title:
ELASTIC CONTACT AND METHOD FOR BONDING BETWEEN METAL TERMINALS USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/041484
Kind Code:
A1
Abstract:
[PROBLEMS] To provide an elastic contact for improving strength of bonding
to a connecting electrode of an electronic component such as an IC package and
to provide a method for bonding between metal terminals. [MEANS FOR SOLVING PROBLEMS]
A connecting electrode (42) formed of a solder on an electronic component side
is brought into contact with a leading end portion (22b) of an elastic contact
(20) at a contact section (O). A resistive layer is formed on the leading end portion
(22b) of the elastic contact (20), and the leading end portion (22b) is arranged
in a gap (51) of an induction coil (50). When a prescribed high frequency current
is permitted to flow in the induction coil (50), the resistive section generates
heat due to electromagnetic induction, and the solder of the connecting electrode
(42) melts and flows into the leading end portion (22b) of the elastic contact
(20). Thus, the leading end portion (22b) of the elastic contact (20) and the
connecting electrode (42) are firmly bonded at one point of the contact section
(O).
More Like This:
Inventors:
NAGANO SHINICHI (JP)
YOSHIDA SHIN (JP)
YOSHIDA SHIN (JP)
Application Number:
PCT/JP2007/068184
Publication Date:
April 10, 2008
Filing Date:
September 19, 2007
Export Citation:
Assignee:
ALPS ELECTRIC CO LTD (JP)
NAGANO SHINICHI (JP)
YOSHIDA SHIN (JP)
NAGANO SHINICHI (JP)
YOSHIDA SHIN (JP)
International Classes:
H01L23/12; C25D7/00; H01L21/60; H01R13/03; H01R33/76
Foreign References:
| JPS5285362A | 1977-07-15 | |||
| JP2006508495A | 2006-03-09 | |||
| JP2003078075A | 2003-03-14 | |||
| JP2000174059A | 2000-06-23 | |||
| JP2006032548A | 2006-02-02 |
Attorney, Agent or Firm:
NOZAKI, Teruo (1-21-11 Higashi-Ikebukuro Toshima-k, Tokyo 13, JP)
Download PDF: