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Patent Searching and Data


Title:
ELASTIC WAVE APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/043151
Kind Code:
A1
Abstract:
Provided is an elastic wave apparatus that uses an S0 mode of a plate wave and with which variations tend not to occur in the speed of sound or frequency characteristics even if the thickness of an electrode film changes. In the elastic wave apparatus 1: an IDT electrode 6 having a plurality of electrode fingers is provided on a first main surface 5a of a piezoelectric thin film 5; a conductive layer 8 is provided on a second main surface 5b of the piezoelectric thin film 5; an elastic wave propagating through the piezoelectric thin film 5 is an S0 mode of a plate wave; and a portion of the piezoelectric thin film 5 in a region under a space between the electrode fingers of the IDT electrode 6 changes more greatly than the electrode fingers and portions of the piezoelectric thin film 5 in the regions under the electrode fingers.

Inventors:
KISHIMOTO YUTAKA (JP)
OMURA MASASHI (JP)
KIMURA TETSUYA (JP)
Application Number:
PCT/JP2016/068569
Publication Date:
March 16, 2017
Filing Date:
June 22, 2016
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/145; H03H9/25
Domestic Patent References:
WO2013172287A12013-11-21
WO2012086441A12012-06-28
Other References:
GONG, SONGBIN ET AL.: "Laterally Vibrating Lithium Niobate MEMS Resonators with High Electromechanical Coupling and Quality Factor", 2012 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM PROCEEDINGS, 10 October 2012 (2012-10-10), pages 1051 - 1054, XP032434306
CHIN MING, LIN ET AL.: "AlN/3C-SiC Composite Plate Enabling High-Frequency and High-Q Micromechanical Resonators", ADVANCED MATERIALS, vol. 24, no. 20, 12 April 2012 (2012-04-12), pages 2722 - 2727
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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