Title:
ELASTIC WAVE DEVICE AND COMPOSITE FILTER DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/113003
Kind Code:
A1
Abstract:
The present invention simplifies a pickup operation and facilities mounting on a module substrate, while mitigating degradation of frequency characteristics due to ripples. This elastic wave device comprises: a first piezoelectric layer having a first major surface and a second major surface; a first support member including a first support substrate overlapping the first piezoelectric layer in a first direction; a first resonator provided on at least the first major surface of the first piezoelectric layer; a second piezoelectric layer having a third major surface and a fourth major surface; a second support member including a second support substrate overlapping the second piezoelectric layer in the first direction; and a second resonator provided on at least the third major surface of the second piezoelectric layer. Each of the first resonator and the second resonator includes a functional electrode. The support member has a space portion overlapping at least part of the functional electrodes of the resonators when viewed in plan in the first direction. A major surface of the first support substrate on the first piezoelectric layer side and a major surface of the second support substrate on the second piezoelectric layer side are opposite each other in the first direction. The first resonator and the second resonator are electrically connected by means of a conductive junction portion extending in the first direction. A space between the first support substrate and the second support substrate is sealed by a sealing member. The first support substrate and the second support substrate differ in thickness.
Inventors:
INOUE KAZUNORI (JP)
Application Number:
PCT/JP2022/046293
Publication Date:
June 22, 2023
Filing Date:
December 15, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/145
Domestic Patent References:
| WO2006008940A1 | 2006-01-26 | |||
| WO2009110062A1 | 2009-09-11 |
Foreign References:
| JP2017228946A | 2017-12-28 | |||
| JP2017212628A | 2017-11-30 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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