Title:
ELASTIC WAVE DEVICE, ELECTRIC WAVE DEVICE PACKAGE, MULTIPLEXER, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATIONS DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/163841
Kind Code:
A1
Abstract:
Provided is an elastic wave device whereby the frequency position of high-order modes propagating inside a support substrate comprising silicon is unlikely to vary. The elastic wave device 1 comprises: a support substrate 2 comprising silicon; a piezoelectric body 4 directly or indirectly provided upon the support substrate 2 and having a pair of mutually facing main surfaces; and an IDT electrode 5 directly or indirectly provided upon at least one main surface of the piezoelectric body 4 and having a wavelength λ determined by electrode finger pitch. The acoustic velocity Vsi = (V1)1/2 of bulk waves propagating inside the support substrate 2 is at least 5,500 m/s, said acoustic velocity being defined by V1, among the solutions V1, V2, V3 for x derived from formula (2). Ax3 + Bx2 + Cx + D = 0 … formula (2)
Inventors:
IWAMOTO HIDEKI (JP)
Application Number:
PCT/JP2018/006418
Publication Date:
September 13, 2018
Filing Date:
February 22, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2011046117A1 | 2011-04-21 | |||
| WO2013172251A1 | 2013-11-21 | |||
| WO2017043394A1 | 2017-03-16 |
Foreign References:
| JP2009524955A | 2009-07-02 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Download PDF:
Previous Patent: SIGNAL PROCESSING DEVICE AND METHOD
Next Patent: ELASTIC WAVE DEVICE, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATIONS DEVICE
Next Patent: ELASTIC WAVE DEVICE, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATIONS DEVICE