Title:
ELASTIC WAVE DEVICE AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/003283
Kind Code:
A1
Abstract:
Provided is an elastic wave device in which, even upon being subjected to an external force or thermal shock, an elastic wave element does not move easily and changes in the frequency characteristics do not occur easily. An elastic wave device 1 comprises a plate-shaped elastic wave element 2 and a resin structure 3. The resin structure 3 includes: a high elastic modulus resin part 3c which has a relatively high elastic modulus; and a low elastic modulus resin part 3d which has a relatively low elastic modulus. The low elastic modulus resin part 3d is provided to a side surface 8a, 8b of an elastic wave element substrate 4 in a region that begins from an end 8a1, 8b1 on an IDT electrode forming surface side but does not reach a surface 7 on the opposite side of the IDT electrode forming surface 5. A remaining resin portion among the portion of the resin structure 3 that contacts the side surface of the elastic wave element substrate 4 constitutes the high elastic modulus resin part 3c.
Inventors:
IWAMOTO TAKASHI (JP)
Application Number:
PCT/JP2017/017147
Publication Date:
January 04, 2018
Filing Date:
May 01, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Foreign References:
| JP2003258162A | 2003-09-12 | |||
| JP2007142149A | 2007-06-07 | |||
| JP2015015546A | 2015-01-22 | |||
| JP2006311183A | 2006-11-09 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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