ELASTIC WAVE DEVICE AND MANUFACTURING METHOD OF ELASTIC WAVE DEVICE

WIPO Patent Application WO/2011/004665

A1

Provided is an elastic wave device that comprises a piezoelectric film supported by a supporter, wherein a configuration is achieved that prevents various malfunctions from occurring upon joining, and that does not let degradation occur, structurally. The elastic wave device is provided with a piezoelectric film (10) that is formed by peeling-off a piezoelectric single-crystal substrate (1), an inorganic layer (20) formed on the back surface (13) of the piezoelectric film (10), an elastic-body layer (30) disposed on the inorganic layer (20) at the surface opposite to the piezoelectric film (10), and the supporter (40) that is laminated onto the elastic-body layer (30) at the surface opposite to the inorganic layer (20). The elastic-body layer (30) has a function to relieve the stress caused by laminating the supporter (40) and the piezoelectric film (10) provided with the inorganic layer (20) together, and has a prescribed modulus of elasticity. Meanwhile, the inorganic layer (20) consists of a material having a bigger modulus of elasticity than the elastic-body layer (30), and minimizes damping due to the installation of the elastic-body layer (30).

IWAMOTO TAKASHI (JP)
KANDO HAJIME (JP)

PCT/JP2010/059419

January 13, 2011

June 03, 2010

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MURATA MANUFACTURING CO (JP)
IWAMOTO TAKASHI (JP)
KANDO HAJIME (JP)

H03H9/145; H03H3/08

WO2006114922A1

2006-11-02

JP2002534886A	2002-10-15
JP2000196410A	2000-07-14
JPS5469048A	1979-06-02
JPH0265519A	1990-03-06
JP2005354507A	2005-12-22
JP2000156624A	2000-06-06
JP2010154315A	2010-07-08

Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)

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