Title:
ELASTIC WAVE DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/178227
Kind Code:
A1
Abstract:
Provided is an elastic wave device that can be reduced in size and is excellent in terms of the joining strength between an elastic wave element and a bump electrode. An elastic wave device (1) includes: a piezoelectric substrate (2); an elastic wave element (7) including an IDT electrode (4) and a pad electrode (5) having a joining layer; a package substrate (3) provided with an electrode land (3a); and a bump electrode (6) that joins the pad electrode (5) and the electrode land (3a) to each other. The joining layer has first and second main surfaces. The first-main-surface side of the joining layer and the bump electrode (6) are joined to each other to form a joint. An alloy layer is formed on the joint. The thickness of the joining layer is 2000 nm or less. The thickness of the alloy layer is 2100 nm or less. The distance from the surface of the alloy layer on the piezoelectric substrate (2) side to the second main surface of the joining layer is 1950 nm or less.
Inventors:
TOCHISHITA HIKARI (JP)
Application Number:
PCT/JP2015/063323
Publication Date:
November 26, 2015
Filing Date:
May 08, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H01L21/60; H03H3/08; H03H9/145
Foreign References:
| JP2013172435A | 2013-09-02 | |||
| JP2005197595A | 2005-07-21 | |||
| JP2003174056A | 2003-06-20 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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