Title:
ELASTIC WAVE DEVICE AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2017/187768
Kind Code:
A1
Abstract:
Provided is an elastic wave device with which productivity can be increased and insertion loss can be decreased. An elastic wave device 1 comprises: a piezoelectric substrate 2; first to third IDT electrodes 4A-4C which are provided on the piezoelectric substrate 2; and a dielectric film 5 which is provided on the piezoelectric substrate 2 so as to cover the first to third IDT electrodes 4A-4C, and in which the thickness of a first region A covering the first IDT electrode 4A is different from the thickness of second and third regions B, C covering the second and third IDT electrodes 4B, 4C. First to third elastic wave filters 3A-3C (first to third elastic wave elements), which include the first to third IDT electrodes 4A-4C and the dielectric film 5, are formed. When the thickness calculated assuming that the densities of the materials constituting the first to third IDT electrodes 4A-4C are all the same density is regarded as the density-converted thickness, the density-converted thicknesses of the first and second IDT electrodes 4A, 4B are the same, and the density-converted thickness of the third IDT electrode 4C is different from the density-converted thicknesses of the first and second IDT electrodes 4A, 4B.
Inventors:
KAWASAKI KENTARO (JP)
Application Number:
PCT/JP2017/007829
Publication Date:
November 02, 2017
Filing Date:
February 28, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/145; H03H3/08; H03H9/25; H03H9/64
Domestic Patent References:
WO2016027707A1 | 2016-02-25 |
Foreign References:
JP2002232264A | 2002-08-16 | |||
JP2005223876A | 2005-08-18 | |||
JP2008079227A | 2008-04-03 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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