Title:
ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING SAME, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/100840
Kind Code:
A1
Abstract:
In order to provide an elastic wave device in which burrs attributable to a metal layer such as a wiring electrode and the like are not easily produced, this elastic wave device 1 is provided with: a piezoelectric body 2 having a principal surface 2a; an IDT electrode provided on the principal surface 2a of the piezoelectric body 2; and wiring electrodes 4 provided on the principal surface 2a of the piezoelectric body 2 and electrically connected to the IDT electrode. The wiring electrode 4 has portions 4a that reach an edge 2c of the principal surface 2a on the piezoelectric body 2, and the width of the wiring electrodes 4 at the edge 2c is less than the widths of the wiring electrodes 4 in portions not at the edge 2c.
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Inventors:
SAKAI RYOSUKE (JP)
Application Number:
PCT/JP2017/033053
Publication Date:
June 07, 2018
Filing Date:
September 13, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/145; H03H3/08; H03H9/25
Domestic Patent References:
| WO2015025618A1 | 2015-02-26 | |||
| WO2016084526A1 | 2016-06-02 |
Foreign References:
| JP2011003674A | 2011-01-06 | |||
| JP2011114332A | 2011-06-09 | |||
| JP2015138828A | 2015-07-30 | |||
| JP2014060806A | 2014-04-03 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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