Title:
ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/059760
Kind Code:
A1
Abstract:
Provided is an elastic wave device and a method for manufacturing an elastic wave device that suppresses ripples in frequency characteristics. The elastic wave device comprises: a support substrate; a piezoelectric layer overlapping the support substrate when viewed in a first direction; and a first electrode and a second electrode which are provided on at least a first major surface of the piezoelectric layer, the first electrode and the second electrode facing each other and having mutually different potentials. A space portion is provided between a second major surface of the piezoelectric layer and the support substrate, the space portion being covered with the piezoelectric layer. Each of the first electrode and the second electrode includes a superimposing portion overlapping the space portion and a non-superimposing portion not overlapping the space portion in the first direction. An attenuation layer having a crystallinity different from the crystallinity of the support substrate is provided in at least a part of the support substrate which, in the first direction, overlaps a region between the non-superimposing portion of the first electrode and the non-superimposing portion of the second electrode.
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Inventors:
INOUE KAZUNORI (JP)
NAGATOMO SHOU (JP)
NAGATOMO SHOU (JP)
Application Number:
PCT/JP2021/034205
Publication Date:
March 24, 2022
Filing Date:
September 16, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2016052129A1 | 2016-04-07 |
Foreign References:
| JP2020136783A | 2020-08-31 | |||
| JP2019192988A | 2019-10-31 | |||
| JP2004096677A | 2004-03-25 | |||
| JP2012015767A | 2012-01-19 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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