Title:
ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/080433
Kind Code:
A1
Abstract:
An elastic wave device comprising a mounting substrate having wiring, an elastic wave element mounted on the mounting substrate, and a cover member covering the elastic wave element, wherein: the elastic wave element comprises a piezoelectric layer having a first main surface and a second main surface opposite to the first main surface, an electrode provided on the first main surface of the piezoelectric layer, and a support substrate laminated on the second main surface of the piezoelectric layer; the first main surface of the piezoelectric layer is disposed so as to face the mounting substrate; a cavity part penetrating the support substrate is provided on a part of the support substrate; in plan view from the first main surface, at least a part of the electrode is provided so as to overlap the cavity part; and the cover member covers the cavity part of the support substrate, and is connected to the mounting substrate so as to cover the side surfaces of the piezoelectric layer and the support substrate.
Inventors:
INOUE KAZUNORI (JP)
ISHII YUTA (JP)
ISHII YUTA (JP)
Application Number:
PCT/JP2021/037964
Publication Date:
April 21, 2022
Filing Date:
October 13, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H3/08; H03H9/17; H03H9/25
Domestic Patent References:
| WO2018110464A1 | 2018-06-21 |
Foreign References:
| US20200321939A1 | 2020-10-08 | |||
| JP2013214954A | 2013-10-17 | |||
| JP2016086308A | 2016-05-19 | |||
| JPS6068710A | 1985-04-19 | |||
| JP2010233210A | 2010-10-14 | |||
| JP2013528996A | 2013-07-11 | |||
| JP2005304021A | 2005-10-27 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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