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Title:
ELASTIC WAVE DEVICE AND ELASTIC WAVE MODULE PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2019/044178
Kind Code:
A1
Abstract:
This elastic wave device (110) is provided with a piezoelectric substrate (10), a plurality of functional elements (60), an outer periphery support layer (20), a cover part (30), and a protective layer (40) for covering the cover part (30). An empty space is formed by the piezoelectric substrate (10), the outer periphery support layer (20), and the cover part (30), and the plurality of functional elements (60) are disposed in the empty space. The elastic wave device (110) is further provided with an under-metal bump layer (66), a wire pattern (62), and a penetration electrode (64) for connecting the under-metal bump layer (66) and the wire pattern (62). The protective layer (40) has a through-hole (80) formed therein, and the through-hole (80) can be filled with a conductive body (68) that electrically connects a solder ball (70) and the under-metal bump layer (66). The outer periphery support layer (20) includes a protrusion (22) that protrudes into the empty space. When the elastic wave device (110) is viewed in a plan view, at least a portion of the through-hole overlaps the empty space, and an end of the protrusion (22) overlaps an inner-side region of the through-hole (80).

Inventors:
KAWASAKI, Koichiro (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2018/025823
Publication Date:
March 07, 2019
Filing Date:
July 09, 2018
Export Citation:
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Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H03H9/25
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (Nakanoshima Festival Tower West, 2-4 Nakanoshima 3-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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