Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/187724
Kind Code:
A1
Abstract:
Provided is an elastic wave device in which holes are unlikely to be produced in a protective film that comprises another dielectric material laminated on a dielectric layer. An IDT electrode 3 is provided on a piezoelectric substrate 2, and an intersecting region of the IDT electrode 3 has a central region in which the sound velocity of an elastic wave is relatively high, and first and second low-sound-velocity sections provided on both sides of the central region in an intersection width direction in which first and second electrode fingers 8, 9 extend, low-sound-velocity material layers 11, 12 being laminated directly or indirectly on the first and second electrode fingers 8, 9 in the first and second low-sound-velocity sections. A first dielectric layer 6, and a second dielectric layer 7 provided on the first dielectric layer 6, are provided so as to cover the IDT electrode 3 and the low-sound-velocity material layers 11, 12. The first dielectric layer 6 has a projecting section 6a1 that projects higher than the other portions above the low-sound-velocity material layers 11, 12. The low-sound-velocity material layers 11, 12 comprise a low-sound-velocity material having a density of 7 g/cm3 or greater.
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Inventors:
DAIMON KATSUYA (JP)
Application Number:
PCT/JP2017/005730
Publication Date:
November 02, 2017
Filing Date:
February 16, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/145
Domestic Patent References:
| WO2009078089A1 | 2009-06-25 |
Foreign References:
| JP2012186808A | 2012-09-27 | |||
| JP2010011440A | 2010-01-14 | |||
| JP2005142629A | 2005-06-02 | |||
| JP2012227626A | 2012-11-15 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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