Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/110464
Kind Code:
A1
Abstract:
In order to provide an elastic wave device that is capable of having a lower profile without compromising resistance against shock caused by laser irradiation during printing or a mounter during mounting, the present invention is provided with: a piezoelectric element substrate 5; IDT electrodes 6 formed on the element substrate 5; and a mold resin 13 formed so as to cover the element substrate 5. When viewed in cross-section, the element substrate 5 is provided with an IDT formation region A on which the IDT electrodes 6 are formed, and a pair of IDT non-formation regions B1, B2 positioned on both sides of the IDT formation region A and on which IDT electrodes 6 are not formed. A thickness dimension X at a center portion in the width direction of the IDT formation region A is made to be smaller than at least one of a thickness dimension Y1 at a center portion in the width direction of the one IDT non-formation region B1, and a thickness dimension Y2 at a center portion in the width direction of the other IDT non-formation region B2.
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Inventors:
TAKESHITA TORU (JP)
Application Number:
PCT/JP2017/044243
Publication Date:
June 21, 2018
Filing Date:
December 08, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H9/145
Domestic Patent References:
| WO2009104438A1 | 2009-08-27 |
Foreign References:
| JP2005223580A | 2005-08-18 | |||
| JPS514240U | 1976-01-13 | |||
| JP2014112607A | 2014-06-19 |
Attorney, Agent or Firm:
KAWAMOTO, Takashi (JP)
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