ELASTIC WAVE DEVICE

WIPO Patent Application WO/2021/241434

A1

Provided is an elastic wave device capable of more reliably suppressing diffusion of Cu of which an IDT electrode is made into a piezoelectric substrate.　The elastic wave device of the present invention is provided with a piezoelectric substrate 2, and an IDT electrode 3 which comprises a first layer 4 provided on the piezoelectric substrate 2 and a second layer 5 composed mainly of Cu and provided on the first layer 4, the IDT electrode 3 having a plurality of electrode fingers. The first layer 4 includes a first main surface 4a positioned on the piezoelectric substrate 2 side, and a second main surface 4b in contact with the second layer 5. The second layer 5 includes a third main surface 5a in contact with the first layer 4, a fourth main surface 5b opposing the third main surface 5a, and a side surface 5c connected to the third and fourth main surfaces 5a, 5b. The IDT electrode 3 further includes a barrier layer 7 (outer layer) provided on the side surface 5c of the second layer 5. A boundary A between the side surface 5c of the second layer 5 and the barrier layer 7 is positioned on the second main surface 4b of the first layer 4, and the barrier layer 7 does not reach the piezoelectric substrate 2.

WO/2022/059758	ELASTIC WAVE DEVICE
JP4717131	Electronic components and their manufacturing methods
JP6981772	Elastic wave device

MIMURA MASAKAZU (JP)
TEGAWA SOICHIRO (JP)

PCT/JP2021/019338

December 02, 2021

May 21, 2021

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MURATA MANUFACTURING CO (JP)

H03H9/145; H03H9/25

WO2012086639A1

2012-06-28

JP2006109287A	2006-04-20
JP2004289441A	2004-10-14
JP2010177393A	2010-08-12
JP2008067289A	2008-03-21

MIYAZAKI & METSUGI (JP)

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